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    Article

    UV/O3 assisted InP/Al2O3–Al2O3/Si low temperature die to wafer bonding

    Direct bonding of InP dies to Si wafer at low temperature utilizing Al2O3 high-κ dielectric as the interfacial material for homogeneous bonding is reported. The bonding technique is assisted with a UV/Ozone expos...

    P. Anantha, C. S. Tan in Microsystem Technologies (2015)

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    Article

    Effect of bonding temperature on hermetic seal and mechanical support of wafer-level Cu-to-Cu thermo-compression bonding for 3D integration

    Hermetic seal and mechanical support of wafer-level Cu-to-Cu thermo-compression bonding with different bonding temperature are analyzed in this work. The investigation consists of two parts: hermetic seal stud...

    J. Fan, D. F. Lim, L. Peng, K. H. Li, C. S. Tan in Microsystem Technologies (2013)

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    Chapter and Conference Paper

    Tight Glycemic Control in Intensive Care: From Engineering to Clinical Practice Change

    Tight glycemic control (TGC) is prevalent in critical care. Providing safe, effective TGC has proven very difficult to achieve with clinically derived protocols. The problem is exacerbated by extreme patient v...

    J. G. Chase, A. J. Le Compte, A. Evans in 5th European Conference of the Internation… (2012)

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    Article

    Graphical approach to tolerance charting—A “maze chart” method

    This paper presents a simple graphical method to represent the process links between surface planes, and leads to ease in performing the validity of a process plan. The approach used the linear optimisation so...

    Dr B. K. A. Ngoi, C. S. Tan in The International Journal of Advanced Manu… (1997)

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    Chapter

    Vortices in Aero-Propulsion Systems

    In this chapter we present examples of vortex motions encountered in turbomachines and aero-propulsion systems. In many cases, such motions have important effects on performance, and the focus is thus on vorte...

    I. A. Waitz, E. M. Greitzer, C. S. Tan in Fluid Vortices (1995)