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Article
UV/O3 assisted InP/Al2O3–Al2O3/Si low temperature die to wafer bonding
Direct bonding of InP dies to Si wafer at low temperature utilizing Al2O3 high-κ dielectric as the interfacial material for homogeneous bonding is reported. The bonding technique is assisted with a UV/Ozone expos...
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Article
Effect of bonding temperature on hermetic seal and mechanical support of wafer-level Cu-to-Cu thermo-compression bonding for 3D integration
Hermetic seal and mechanical support of wafer-level Cu-to-Cu thermo-compression bonding with different bonding temperature are analyzed in this work. The investigation consists of two parts: hermetic seal stud...
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Chapter and Conference Paper
Tight Glycemic Control in Intensive Care: From Engineering to Clinical Practice Change
Tight glycemic control (TGC) is prevalent in critical care. Providing safe, effective TGC has proven very difficult to achieve with clinically derived protocols. The problem is exacerbated by extreme patient v...
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Article
Graphical approach to tolerance charting—A “maze chart” method
This paper presents a simple graphical method to represent the process links between surface planes, and leads to ease in performing the validity of a process plan. The approach used the linear optimisation so...
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Chapter
Vortices in Aero-Propulsion Systems
In this chapter we present examples of vortex motions encountered in turbomachines and aero-propulsion systems. In many cases, such motions have important effects on performance, and the focus is thus on vorte...