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  1. No Access

    Article

    Dislocation structure in low-angle interfaces between bonded Si(001) wafers

    Dislocation structures of interfaces between bonded (001) Si wafers with co-existing low-angle twist and tilt misorientations were studied by transmission electron microscopy. At dominating twist, a square scr...

    T. Akatsu, R. Scholz, U. Gösele in Journal of Materials Science (2004)

  2. No Access

    Article

    New layer transfers obtained by the SmartCut process

    The SmartCut process was first developed to obtain silicon-on-insulator (SOI) materials. Now an industrial process, the main Unibond SOI-structure trends are reported in this paper. Many material combinations ...

    H. Moriceau, F. Fournel, B. Aspar, B. Bataillou… in Journal of Electronic Materials (2003)

  3. No Access

    Article

    Divorced eutectic and interface characteristics in a solidified YAG-spinel composite with spinel-rich composition

    Solidified microstructures of YAG (Y3Al5O12)-spinel (MgAl2O4) composite with spinel-rich composition (YAG : spinel = 1 : 30 molar ratio) were investigated. Intergranular YAG divorced eutectic exhibiting fine-grai...

    S. Wang, T. Akatsu, Y. Tanabe, E. Yasuda in Journal of Materials Science (2000)

  4. No Access

    Article

    Atomic structure of Al/Al interface formed by surface activated bonding

    Single crystalline Al crystals were bonded via surface activated bonding at room temperature with the crystallographic orientation of (111)∥(111) and [110]∥[110]. The interfacial microstructure was investigate...

    T. Akatsu, N. Hosoda, T. Suga, M. Rühle in Journal of Materials Science (1999)

  5. No Access

    Article

    Metastable precipitation in isothermally solidified YAG-alumina composites with off-eutectic composition

    YAG-alumina composites with Al2O3-rich and YAG-rich compositions were prepared by annealing the hot-pressed composites at the eutectic temperature (1820°C) for 1 h followed by cooling down at 10 or 100°C/min in a...

    S. Wang, F. Yamamoto, T. Akatsu, Y. Tanabe, E. Yasuda in Journal of Materials Science (1999)

  6. No Access

    Article

    Metastable precipitation of YAIO3 in isothermally solidified YAG/(Al2O3-rich) spinel composites

    Phase composition and microstructure of isothermally solidified YAG/spinel (or Al2O3-rich solid solution) composites were investigated. It was verified that an equilibrium binary eutectic phase region consisti...

    S. Wang, F. Yamamoto, T. Akatsu, Y. Tanabe, E. Yasuda in Journal of Materials Science (1998)

  7. No Access

    Article

    Anisotropy of creep deformation rate in hot-pressed Si3N4 with preferred orientation of the elongated grains

    Compressive creep deformation of hot-pressed silicon nitride with two different preorientations of grain was investigated at temperatures in the range of 1300–1400 °C under 30–100 MPa. The stress exponent of t...

    S. Y Yoon, T Akatsu, E Yasuda in Journal of Materials Science (1997)

  8. No Access

    Article

    Shear strength of C/C composites containing an inorganic compound effective for anti-oxidation

    Abstracts are not published in this journal

    Y. Tanabe, Y. Hotta, T. Akatsu, S. Yamada… in Journal of Materials Science Letters (1997)