-
Article
Low melting point nanocrystalline Sn–Ag solder synthesized by a refined chemical reduction method
The commercial market of Sn–Pb solder is gradually decreasing due to its toxicity, calling for Pb-free substitute materials. Sn–Ag alloy is a potential candidate in terms of good mechanical property. The major...
-
Article
Size-dependent undercooling of pure Sn by single particle DSC measurements
The size-dependent solidification undercooling was investigated for single micro-sized particles of pure Sn employing differential scanning calorimeter (DSC). The particles were obtained from a solvent-encapsu...
-
Article
Fast calorimetric scanning of micro-sized SnAgCu single droplet at a high cooling rate
The undercooling of the single micro-sized droplet of Sn-3.0Ag-0.5Cu (wt%) alloy has been studied via the newly developed fast calorimetric scanning technique, by which the fast heating and cooling treatment f...