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    Low melting point nanocrystalline Sn–Ag solder synthesized by a refined chemical reduction method

    The commercial market of Sn–Pb solder is gradually decreasing due to its toxicity, calling for Pb-free substitute materials. Sn–Ag alloy is a potential candidate in terms of good mechanical property. The major...

    Bingge Zhao, Weipeng Zhang, Changdong Zou, Qijie Zhai in Chinese Science Bulletin (2014)

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    Size-dependent undercooling of pure Sn by single particle DSC measurements

    The size-dependent solidification undercooling was investigated for single micro-sized particles of pure Sn employing differential scanning calorimeter (DSC). The particles were obtained from a solvent-encapsu...

    Bin Yang, YuLai Gao, ChangDong Zou, QiJie Zhai, E. Zhuravlev in Chinese Science Bulletin (2010)

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    Fast calorimetric scanning of micro-sized SnAgCu single droplet at a high cooling rate

    The undercooling of the single micro-sized droplet of Sn-3.0Ag-0.5Cu (wt%) alloy has been studied via the newly developed fast calorimetric scanning technique, by which the fast heating and cooling treatment f...

    YuLai Gao, ChangDong Zou, Bin Yang in Science in China Series E: Technological S… (2009)