Skip to main content

1 Result(s)

within Ziang Gong Remove this filter

and

  1. Article

    Open Access

    Segmentation of void defects in X-ray images of chip solder joints based on PCB-DeepLabV3 algorithm

    Defects within chip solder joints are usually inspected visually for defects using X-ray imaging to obtain images. The phenomenon of voids inside solder joints is one of the most likely types of defects in the...

    Defeng Kong, **nyu Hu, Ziang Gong, Daode Zhang in Scientific Reports (2024)

    Download PDF (2939 KB) View Article