10 Result(s)
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Article
Mechanism of metal nanowire formation via the polyol process
The morphology and cap** layer of Ag-nanowires prepared using the polyol process were examined to understand their formation mechanism. Cu-nanowires prepared from the salt reduction process were examined as ...
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Article
Influence of pad shape on self-alignment in electronic packaging
Anisotropic self-alignment of the noncircular pads is investigated to reduce the misalignment in electronic packaging, and the effects of the direction and length ratio of the noncircular pads are analyzed. Th...
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Article
Reaction characteristics of the In-15Pb-5Ag solder with a Au/Ni/Cu pad and their effects on mechanical properties
Reaction characteristics of the In-15Pb-5Ag (wt.%) solder with a Au/Ni/Cu pad during reflow soldering and aging treatment were examined. Interfacial reaction during reflow resulted in either an AuIn2 or Ni28In72 ...
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Article
Kinetics of the Au-Ni-Sn ternary intermetallic layer redeposition at the solder/under-bump metallurgy interface during aging treatment
The Au-Ni-Sn ternary intermetallic layer redeposition at the interface between the solder and the Au/Ni/Cu under-bump metallurgy (UBM) was measured experimentally and analyzed theoretically. The predicted thic...
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Article
Reaction characteristics of the Au-Sn solder with under-bump metallurgy layers in optoelectronic packages
The reaction characteristics of molten Au/Sn eutectic solder with potential diffusion-barrier materials of optoelectronic packages were investigated. The characteristics were studied by reflowing the solder on...
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Article
Kinetics of intermetallic formation at Sn-37Pb/Cu interface during reflow soldering
The kinetics of the intermetallic layer formation at Sn-37wt.%Pb solder/Cu pad interface during reflow soldering were studied. The growth kinetics were analyzed theoretically by assuming that the mass flux of ...
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Article
Laser soldering for chip-on-glass mounting in flat panel display application
Chip-on-glass (COG) mounting of area array electronic packages was attempted by heating the rear surfrace of a contact pad film deposited on a glass substrate. The pads consisted of an adhesion (i.e., Cr or Ti...
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Article
Kinetics of Au-containing ternary intermetallic redeposition at solder/UBM interface
In this study, the effects of the under bump metallurgy (UBM) structure and Cu content in solders on the redeposition rate of Au-containing ternary intermetallics at the solder/UBM interface were investigated....
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Article
Reliability of composite solder bumps produced by an in-situ process
In an attempt to develop a thermally stable solder system, an in-situ Pb-Sn solder composite reinforced with Cu6Sn5 dispersoids was investigated for its thermal stability. The stability was evaluated mainly by me...
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Article
Characteristics of the Sn-Pb eutectic solder bump formed via fluxless laser reflow soldering
In an attempt to develop a fluxless reflow solder bum** process, the effects of processing variables, which include energy input rate and time, and the shape of solder disk on the microstructure of the solde...
