Abstract
The kinetics of the intermetallic layer formation at Sn-37wt.%Pb solder/Cu pad interface during reflow soldering were studied. The growth kinetics were analyzed theoretically by assuming that the mass flux of Cu through channels between scalloplike grains primarily contributes to the growth. Rate-controlling steps considered for the mass flux were the Cu dissolution from the bottom of the channels, diffusion through the channel, and the formation reaction of the intermetallic layer. These results indicated that a transition in the growth rate observed around 120–150 sec of reflow time may be associated with transition of the rate-controlling step from the Cu dissolution to the Cu diffusion through the channel.
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Lee, JH., Kim, YS. Kinetics of intermetallic formation at Sn-37Pb/Cu interface during reflow soldering. J. Electron. Mater. 31, 576–583 (2002). https://doi.org/10.1007/s11664-002-0128-1
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DOI: https://doi.org/10.1007/s11664-002-0128-1