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Chapter and Conference Paper
Designing Cancellation Intervention System with Sliding Lead Times
In this paper, we propose a new cancellation intervention system to minimize possible revenue loss of business entity in tourism sector from last-minute booking cancellation. The proposed system automatically ...
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Article
Effects of double heat treatment of NiO hole transport layer on the performance of QLEDs
Parameters affecting the performance of QLED devices using NiO hole transport layer (HTL) thin film via the sol–gel process route were investigated. In the preparation of the NiO HTL thin film, a double heat t...
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Article
Mechanism of metal nanowire formation via the polyol process
The morphology and cap** layer of Ag-nanowires prepared using the polyol process were examined to understand their formation mechanism. Cu-nanowires prepared from the salt reduction process were examined as ...
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Chapter
Membership Reconfiguration in Knowledge Sharing Network: A Simulation Study
The purpose of this study is to propose a new approach that minimizes the negative impacts of structural barriers to knowledge sharing in the current of knowledge sharing networks by dynamically reconfiguring ...
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Chapter
Agile Supply Chain Decision Support System
Recently, many organizations intend to make their supply chains more responsive to the change in demand in terms of volume and variety and hence consider agility one of the most critical evaluation criteria in...
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Article
Influence of pad shape on self-alignment in electronic packaging
Anisotropic self-alignment of the noncircular pads is investigated to reduce the misalignment in electronic packaging, and the effects of the direction and length ratio of the noncircular pads are analyzed. Th...
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Article
Fabrication of monodisperse silica spheres using statistical design of experiments
The statistical design of experiments was successfully carried out in order to synthesize monodisperse silica spheres using a fractional factorial design with a resolution of V. In this design, the input varia...
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Article
Reaction characteristics of the In-15Pb-5Ag solder with a Au/Ni/Cu pad and their effects on mechanical properties
Reaction characteristics of the In-15Pb-5Ag (wt.%) solder with a Au/Ni/Cu pad during reflow soldering and aging treatment were examined. Interfacial reaction during reflow resulted in either an AuIn2 or Ni28In72 ...
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Article
Kinetics of the Au-Ni-Sn ternary intermetallic layer redeposition at the solder/under-bump metallurgy interface during aging treatment
The Au-Ni-Sn ternary intermetallic layer redeposition at the interface between the solder and the Au/Ni/Cu under-bump metallurgy (UBM) was measured experimentally and analyzed theoretically. The predicted thic...
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Article
Dissolution of Cu into Sn-based solders during reflow soldering
Cu contents in pure Sn and Sn-37Pb solders were measured as a function of reflowing time. The results indicated that the contents are significantly higher than that of the Cu solubility limit in each solder. S...
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Article
Reaction characteristics of the Au-Sn solder with under-bump metallurgy layers in optoelectronic packages
The reaction characteristics of molten Au/Sn eutectic solder with potential diffusion-barrier materials of optoelectronic packages were investigated. The characteristics were studied by reflowing the solder on...
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Article
Kinetics of intermetallic formation at Sn-37Pb/Cu interface during reflow soldering
The kinetics of the intermetallic layer formation at Sn-37wt.%Pb solder/Cu pad interface during reflow soldering were studied. The growth kinetics were analyzed theoretically by assuming that the mass flux of ...
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Article
Effect of mechanical alloying on combustion synthesis of MoSi2
Characteristics of the combustion synthesis of MoSi2 using elemental Mo and Si powder mixtures prepared by mechanical alloying were investigated. The mechanical alloying resulted in powders of pseudolamellar stru...
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Article
Microstructural stability of ultrafine grained low-carbon steel containing vanadium fabricated by intense plastic straining
Two grades of low-carbon steel, one containing vanadium and the other without vanadium, were subjected to equal channel angular pressing (ECAP) at 623 K up to an effective strain of ∼4. After equal channel ang...
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Article
Laser soldering for chip-on-glass mounting in flat panel display application
Chip-on-glass (COG) mounting of area array electronic packages was attempted by heating the rear surfrace of a contact pad film deposited on a glass substrate. The pads consisted of an adhesion (i.e., Cr or Ti...
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Article
Kinetics of Au-containing ternary intermetallic redeposition at solder/UBM interface
In this study, the effects of the under bump metallurgy (UBM) structure and Cu content in solders on the redeposition rate of Au-containing ternary intermetallics at the solder/UBM interface were investigated....
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Article
Stability of channels at a scalloplike Cu6Sn5 layer in solder interconnections
The thermodynamic stability of the solder channels at a scalloplike Cu6Sn5 layer formed between Sn-containing solders and Cu substrate was evaluated by studying the penetration behavior of the liquid solders into...
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Article
Effects of Cu and Ni additions to eutectic Pb–Sn solders on Au embrittlement of solder interconnections
Effects Cu and Ni additions on Au embrittlement of eutectic Sn–Pb solder interconnections during a solid-state aging treatment were evaluated using a ball shear testing method. The addition resulted in a forma...
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Article
Reliability of composite solder bumps produced by an in-situ process
In an attempt to develop a thermally stable solder system, an in-situ Pb-Sn solder composite reinforced with Cu6Sn5 dispersoids was investigated for its thermal stability. The stability was evaluated mainly by me...
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Article
Characteristics of the Sn-Pb eutectic solder bump formed via fluxless laser reflow soldering
In an attempt to develop a fluxless reflow solder bum** process, the effects of processing variables, which include energy input rate and time, and the shape of solder disk on the microstructure of the solde...
