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  1. No Access

    Article

    Laparoscopic colorectal anastomosis technique without ‘‘dog ear’’ formation using LigaSure for bowel transection

    M.-T. Wei, T.-H. Yang, X.-B. Deng, W.-J. Meng, J.-H. Han in Techniques in Coloproctology (2020)

  2. No Access

    Article

    Hierarchical NiO Microflowers for High Performance Supercapacitors

    Hierarchical NiO-microstructures including microflowers are synthesized on the surface of copper foams via hydrothermal precipitation. The surface morphology and structure of the NiO-microstructures are invest...

    X. J. Wang, X. A. **a, W. J. Meng, C. X. Yang, M. Q. Guo in Journal of Electronic Materials (2018)

  3. No Access

    Article

    Mechanical response of mesoscopic aluminum rings under uniaxial compression

    The strength of materials exhibits size effects at sample dimensions <1 mm. In the literature, two trends are identified in the length scale spectrum: smaller is stronger at <10 μn; larger is stronger at >500 ...

    Bin Zhang, Shahrior Ahmed, Shuai Shao, W. J. Meng in MRS Communications (2018)

  4. No Access

    Article

    Quantifying the rural residential energy transition in China from 1992 to 2012 through a representative national survey

    Rural household energy use for cooking and heating is an important source of air pollutants in China, as it affects both human health and climate change. However, the magnitude of rural household energy use, e...

    S. Tao, M. Y. Ru, W. Du, X. Zhu, Q. R. Zhong, B. G. Li, G. F. Shen in Nature Energy (2018)

  5. No Access

    Article

    On single-phase status and segregation of an as-solidified septenary refractory high entropy alloy

    Phase predictions and characterizations on as-solidified septenary refractory high-entropy alloy, CrMoNbReTaVW, are presented. The simulated solidification process predicts a single body-centered-cubic (BCC) c...

    Boliang Zhang, Yang Mu, M. C. Gao, W. J. Meng, S. M. Guo in MRS Communications (2017)

  6. Article

    Pancreas-oriented superior mesenteric vein dissection for D3 lymphadenectomy in laparoscopic right hemicolectomy

    W.-J. Meng, X.-B. Deng, Y.-C. Zhang, M.-T. Wei, C.-W. ** in Techniques in Coloproctology (2016)

  7. No Access

    Article

    Dependence of confined plastic flow of polycrystalline Cu thin films on microstructure

    Axial compression was conducted on micro-pillars, in which polycrystalline Cu thin films were sandwiched between CrN and Si. Plastic flow of Cu was achieved, when the Cu films are inclined either at 90° or 45°...

    Yang Mu, **aoman Zhang, J. W. Hutchinson, W. J. Meng in MRS Communications (2016)

  8. No Access

    Article

    Reducing dioxin formation by adding hydrogen in simulated fly ash

    In this study, simulated fly ash containing CuO/CuCl2 was heated at 350 °C in a flow of N2 and also in a nitrogen flow containing 10 vol% H2, to evaluate the influence of hydrogen adding on dioxin formation. The ...

    J. Yang, X. D. Li, W. J. Meng, S. Y. Lu in Environmental Science and Pollution Resear… (2015)

  9. No Access

    Article

    Thickness dependence of flow stress of Cu thin films in confined shear plastic flow

    Compression loading on CrN/Cu/Si(100) micropillars containing 45°-inclined interfaces yielded unequivocal evidence of shear plastic flow within Cu thin films confined between non-deforming Si and CrN. Confined...

    Yang Mu, Ke Chen, W. J. Meng in MRS Communications (2014)

  10. No Access

    Article

    A new experimental approach for evaluating the mechanical integrity of interfaces between hard coatings and substrates

    We describe a new protocol for testing coating/substrate interfacial failures through compression loading of micro-pillars containing an inclined interface region, experimentally realized in the TiN/Ti/Si(100)...

    Ke Chen, Yang Mu, W. J. Meng in MRS Communications (2014)

  11. No Access

    Article

    Low temperature deposited titanium boride thin films and their application to surface engineering of microscale mold inserts

    Titanium boride thin films were deposited at low temperatures by balanced magnetron sputtering and inductively coupled plasma (ICP) assisted balanced magnetron sputtering. The chemical composition, surface mor...

    Yang Mu, Ke Chen, W. J. Meng, Fanghua Mei in Microsystem Technologies (2012)

  12. No Access

    Article

    Microelectronic chip cooling: an experimental assessment of a liquid-passing heat sink, a microchannel heat rejection module, and a microchannel-based recirculating-liquid cooling system

    Results of heat transfer testing of heat absorption modules (HAM), heat rejection modules (HRM), and a recirculating-liquid cooling system are reported. Low-profile, Cu-based, microchannel heat exchangers (MHE...

    Bin Lu, W. J. Meng, Fanghua Mei in Microsystem Technologies (2012)

  13. No Access

    Article

    Numerical research on properties of optical-wave target detection and imaging from NR-PC flat lens

    The characteristics of optical-wave target detection and imaging from a negative-refraction photonic crystal (NR-PC) flat lens are studied with a two-dimensional (2D) finite-difference time-domain (FDTD) metho...

    T. G. Shen, W. J. Meng, J. Sun, Z. H. Li, B. G. Yuan, G. Wang in Applied Physics B (2010)

  14. No Access

    Article

    Structure of vapor-phase deposited Al-Ge thin films and Al-Ge intermediate layer bonding of Al-based microchannel structures

    Al-based high-aspect-ratio microscale structures (HARMS) are basic building blocks for all-Al microdevices. Bonding of Al-based HARMS is essential for device assembly. In this paper, bonding of Al-based HARMS ...

    Fanghua Mei, W.J. Meng, J. Hiller, D.J. Miller in Journal of Materials Research (2009)

  15. No Access

    Article

    Microscale molding replication of Cu- and Ni-based structures

    Microdevices and microsystems made of metals can possess unique functionalities. Metal-based high-aspect-ratio microscale structures (HARMS) are basic building blocks of such microdevices and microsystems. Cos...

    J. Jiang, Fanghua Mei, W. J. Meng, E. Lara-Curzio in Microsystem Technologies (2008)

  16. No Access

    Article

    Direct microscale imprinting of Al at room temperature with Si inserts

    For direct imprinting of metals, hard materials such as diamond and SiC have been used to construct mold inserts in preference to Si, despite the ease in fabricating Si-based micro-/nano- scale structures. In ...

    J. Jiang, Fanghua Mei, W. J. Meng, G. B. Sinclair in Microsystem Technologies (2008)

  17. No Access

    Article

    Evaluation of eutectic bond strength and assembly of Al-based microfluidic structures

    Metal-based microscale heat exchangers have potential advantages over similar Si-based devices. Bonding and assembly are critical for building functional metal-based microfluidic devices from metallic high-asp...

    Fanghua Mei, J. Jiang, W. J. Meng in Microsystem Technologies (2008)

  18. No Access

    Article

    Further experiments and modeling for microscale compression molding of metals at elevated temperatures

    Replication of metallic high-aspect-ratio microscale structures (HARMS) by compression molding has been demonstrated recently. Molding replication of metallic HARMS can potentially lead to low-cost fabrication...

    J. Jiang, W.J. Meng, G.B. Sinclair, E. Lara-Curzio in Journal of Materials Research (2007)

  19. No Access

    Article

    Eutectic bonding of Al-based high aspect ratio microscale structures

    Metal-based microelectromechanical systems (MEMS) have important advantages over Si-based MEMS. To form any functional metal-based microdevice from metallic high-aspect-ratio microscale structures (HARMS), pro...

    Fanghua Mei, J. Jiang, W. J. Meng in Microsystem Technologies (2007)

  20. No Access

    Article

    Fabrication of high-aspect-ratio microscale Ta mold inserts with micro electrical discharge machining

    We report fabrication of microscale Ta mold inserts by micro-electrical-discharge-machining (μEDM). Morphology, chemistry, and structure of the near-surface region of as-μEDMed Ta blanks have been characterize...

    D. M. Cao, J. Jiang, W. J. Meng, J. C. Jiang, W. Wang in Microsystem Technologies (2007)

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