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  1. No Access

    Article

    Local/global planarization of polysilicon micropatterns by selectivity controlled CMP

    The planarization CMP, which is considered as one of the most important ULSI chip, is introduced to make flat surface in patterned areas for multilevel MEMS devices. However, the conventional CMP is limited in...

    Woonki Shin, Sungmin Park, Hyoungjae Kim… in International Journal of Precision Enginee… (2009)

  2. No Access

    Reference Work Entry In depth

    Secondary Ion Mass Spectroscopy (SIMS)

    Sukbae Joo, Dr. Hong Liang in Encyclopedia of Tribology (2013)

  3. No Access

    Chapter

    Tribology in Chemical–Mechanical Planarization

    Chemical–mechanical planarization (CMP) is one of the most important process steps in making integrated circuits. Tribology plays significant roles in material removal, polishing, and planarization. This chapt...

    Sukbae Joo, Hong Liang in Tribology for Scientists and Engineers (2013)

  4. No Access

    Article

    In Situ Characterization of Triboelectrochemical Effects on Topography of Patterned Copper Surfaces

    The topographic response of patterned copper surfaces to chemical–mechanical polishing (CMP) was investigated using a triboelectrochemical approach. Experimental methods include using a combined system contain...

    Sukbae Joo, Hong Liang in Journal of Electronic Materials (2013)