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3 Result(s)

within Sabuj Mallik Remove this filter Optical and Electronic Materials Remove this filter

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  1. Article

    Open Access

    Characterising Solder Materials from Random Vibration Response of Their Interconnects in BGA Packaging

    Solder interconnection in electronic packaging is the weakest link, thus driving the reliability of electronic modules and systems. Improving interconnection integrity in safety-critical applications is vital ...

    Joshua A. Depiver, Sabuj Mallik, Emeka H. Amalu in Journal of Electronic Materials (2023)

    Download PDF (3961 KB) View Article

  2. No Access

    Article

    Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistors

    The integrity of solder joints of components in an electronic device is critical to the device reliability. The miniaturisation trend in the development of electronic products has continued to challenge the s...

    Jude E. Njoku, Emeka H. Amalu, Ndy Ekere, Sabuj Mallik… in Journal of Electronic Materials (2023)

  3. Article

    Open Access

    Effective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB)

    Ball grid array (BGA) packages have increasing applications in mobile phones, disk drives, LC displays and automotive engine controllers. However, the thermo-mechanical reliability of the BGA solder joints cha...

    Joshua A. Depiver, Sabuj Mallik, Emeka H. Amalu in Journal of Electronic Materials (2021)

    Download PDF (3435 KB)