24 Result(s)

Article

Applications of a Family of Unconditionally Stable, Dissipative, Explicit Methods to Pseudodynamic Tests

A newly developed dissipative family method is adopted and implemented for pseudodynamic tests in this investigation since it can have desired numerical properties. In fact, it can integrate unconditional stab...

S-Y. Chang, T-H. Wu, N-C. Tran, Y-S. Yang in Experimental Techniques (2017)

Article

Effects of copper content on the microstructure and brazing properties of Al-Si-Cu-Zn-Re filler metals

The microstructure, phase constitution, melting character, and 6061 aluminum alloy brazing properties of Al-Si-Cu-Zn-Re filler metals with different copper contents were investigated. The Al-9.6Si-10Cu-10Zn-0....

S. Y. Chang, Y. H. Lei, L. C. Tsao, T. Y. Li in Welding in the World (2016)

Article

Effect of TiO₂ nanoparticle addition and cooling rate on microstructure and mechanical properties of novel Sn1.5Sb0.7Cu solders

The effects of TiO₂ nanoparticles and cooling rate on the microstructure and mechanical properties of Sn1.5Sb0.7Cu alloy were investigated. A higher cooling rate and TiO₂ nanoparticles refined the primary β-Sn de...

C. H. Huang, Chin-Hsin Chen, S. Y. Chang… in Journal of Materials Science: Materials in… (2015)

Article

Self-consolidation mechanism of porous-surfaced Ti implant compacts induced by electro-discharge-sintering of spherical Ti powders

Porous-surfaced Ti implant compacts, with a solid core surrounded by a porous layer, were self-assembled by electro-discharge-sintering directly from spherical Ti powders. During an electro-discharge, instant ...

Y. H. Jo, Y. H. Kim, Y. J. Jo, J. G. Seong… in Metals and Materials International (2015)

Article

Rapid formation of Ti oxycarbide on the surface of Ti induced by electro-discharge-heat-treatment in a low vacuum atmosphere

A single pulse of 2.0 to 3.5 kJ of input energy from a 450 μF capacitor was applied in a low vacuum atmosphere to a commercially pure Ti rod. The electro-discharge process produced rapid temperature increases ...

Y. J. Jo, Y. H. Kim, Y. H. Jo, J. G. Seong, Y. K. Ko… in Metals and Materials International (2015)

Article

Effect of TiO₂ nanoparticles on the microstructure and bonding strengths of Sn0.7Cu composite solder BGA packages with immersion Sn surface finish

This study investigated the effects of TiO₂ nanoparticles on the interfacial microstructures and bonding strength of Sn0.7Cu (SC) composite solder joints in ball grid array packages with immersion Sn surface fini...

L. C. Tsao, M. W. Wu, S. Y. Chang in Journal of Materials Science: Materials in Electronics (2012)

Article

The morphology and kinetic evolution of intermetallic compounds at Sn–Ag–Cu solder/Cu and Sn–Ag–Cu-0.5Al₂O₃ composite solder/Cu interface during soldering reaction

In this work, Sn3.0Ag0.7Cu (SAC) composite solders were produced by mechanically intermixing 0.5 wt% Al₂O₃ nanoparticles into Sn3.0Ag0.7Cu solder. The formation and growth kinetics of the intermetallic compounds ...

S. Y. Chang, L. C. Tsao, M. W. Wu… in Journal of Materials Science: Materials in… (2012)

Article

Strengthening mechanism of nano-Al₂O₃ particles reinforced Sn3.5Ag0.5Cu lead-free solder

To improve the properties of the eutectic Sn3.5Ag0.5Cu lead-free solder, various amounts of mixed nano-Al₂O₃ particles were added. The microstructure, thermal analysis, density, thermal expansion coefficient (CTE...

T. H. Chuang, M. W. Wu, S. Y. Chang… in Journal of Materials Science: Materials in… (2011)

Article

Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates

The morphology and growth kinetics of intermetallic compounds (IMCs) formed during the soldering reactions between Sn3.5Ag0.5Cu and Ag substrates at various temperatures ranging from 250 to 350 °C were investi...

R. W. Wu, L. C. Tsao, S. Y. Chang… in Journal of Materials Science: Materials in… (2011)

Article

Confirmation of pseudodynamic technique for bidirectional loading

S. -Y. Chang in Experimental Techniques (2011)

Article

Low Temperature Bonding of Alumina/Alumina and Alumina/Copper in Air Using Sn3.5Ag4Ti(Ce,Ga) Filler

Sn3.5Ag4Ti(Ce,Ga) active filler was used for joining alumina with alumina and alumina with copper at 250°C in air. The joining process was done without flux and without the need for pre-metallization of alumin...

S.Y. Chang, T.H. Chuang, C.L. Yang in Journal of Electronic Materials (2007)

Article

The Isothermal and Cyclic Oxidation Behavior of a Titanium Aluminide Alloy at Elevated Temperature

The isothermal and cyclic oxidation behavior of Ti-47Al-2Mn-2Nb with 0.8 vol.% TiB₂ particle-reinforced alloy was investigated in air between 700 and 1000 °C. In the study, the kinetics of isothermal and cyclic o...

S.Y. Chang in Journal of Materials Engineering and Performance (2007)

Article

Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages

After reflow of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder balls on Au/Ni surface finishes in ball grid array (BGA) packages, scallop-shaped intermetallic compounds (Cu_0.70Ni_0.28Au_0.02)₆Sn₅ (IM1a) and (Cu_0.76Ni_0...

M. D. Cheng, S. Y. Chang, S. F. Yen, T. H. Chuang in Journal of Electronic Materials (2004)

Article

Mechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substrates

Intermetallic compounds formed during the soldering reactions between Sn-3.5Ag and Cu at temperatures ranging from 250°C to 375°C are investigated. The results indicate that scallop-shaped η-Cu₆(Sn_0.933 Ag_0.007)₅

T. H. Chuang, H. M. Wu, M. D. Cheng, S. Y. Chang… in Journal of Electronic Materials (2004)

Article

Reflow and burn-in of a Sn-20In-0.8Cu ball grid array package with a Au/Ni/Cu pad

The intermetallic compounds formed after reflow and burn-in testing of a Sn-20In-0.8Cu solder ball grid array (BGA) package are investigated. Along with the formation of the Cu₆(Sn_0.78In_0.22)₅ precipitates (IM1) ...

M. J. Chiang, S. Y. Chang, T. H. Chuang in Journal of Electronic Materials (2004)

Article

Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al₂O₃ with Sn interlayers

The multilayer thin-film systems of Cu/Ti/Si and Au/Cu/Al₂O₃ were diffusion-soldered at temperatures between 250°C and 400°C by inserting a Sn thin-film interlayer. Experimental results showed that a double layer...

M. W. Liang, T. E. Hsieh, S. Y. Chang, T. H. Chuang in Journal of Electronic Materials (2003)

Article

Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler

Indium tin oxide (ITO) ceramics are bonded with ITO and Cu at 250 °C in air using an active solder Sn3.5Ag4Ti(Ce, Ga). The mechanism for such low temperature soldering of ITO ceramics in air has been investiga...

S. Y. Chang, L. C. Tsao, M. J. Chiang… in Journal of Materials Engineering and Perfo… (2003)

Article

Joining alumina to inconel 600 and UMCo-50 superalloys using an Sn10Ag4Ti active filler metal

Alumina ceramics were brazed to Inconel 600 and UMCo-50 superalloys at 900 °C for 10 min using an Sn10Ag4Ti active filler metal. The brazing filler showed good wettability on alumina and superalloys. The flexu...

S. Y. Chang, Y. T. Hung, T. H. Chuang in Journal of Materials Engineering and Performance (2003)

Article

Intermetallic compounds formed during the reflow of In-49Sn solder ball-grid array packages

The intermetallic compounds formed at the interfaces between In-49Sn solder balls and Au/Ni/Cu pads during the reflow of In-49Sn solder, ball-grid array (BGA) packages are investigated. Various temperature pro...

T. H. Chuang, S. Y. Chang, L. C. Tsao, W. P. Weng… in Journal of Electronic Materials (2003)