![Loading...](https://link.springer.com/static/c4a417b97a76cc2980e3c25e2271af3129e08bbe/images/pdf-preview/spacer.gif)
-
Article
Electron backscattered diffraction and energy dispersive X-ray spectroscopy study of the phase NiSn4
Electron backscattered diffraction (EBSD) and energy dispersive X-ray spectroscopy (EDS) have been performed on a plate-shaped phase formed through the reaction of Sn and Ni. The phase is formed during extende...
-
Article
Observed correlation of Sn oxide film to Sn whisker growth in Sn-Cu electrodeposit for Pb-free solders
Localized cracking of surface oxide has been proposed as a necessary step in the nucleation of Sn whiskers in Sn electrodeposited films. To evaluate the effects of the oxide film on Sn whisker growth, a bright...
-
Article
Hillock and Whisker Growth on Sn and SnCu Electrodeposits on a Substrate Not Forming Interfacial Intermetallic Compounds
Intermetallic compound (IMC) formation at the interface between the tin (Sn) plating and the copper (Cu) substrate of electronic components has been thought to produce compressive stress in Sn electrodeposits ...
-
Article
Equi-Axed Grain Formation in Electrodeposited Sn-Bi
Sn is widely used as a coating in the electronics industry because it provides excellent solderability, ductility, electrical conductivity, and corrosion resistance. However, Sn whiskers have been observed to ...