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4 Result(s)

within M. E. Williams Remove this filter Materials Science Remove this filter Characterization and Evaluation of Materials Remove this filter Electronics and Microelectronics, Instrumentation Remove this filter

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  1. No Access

    Article

    Electron backscattered diffraction and energy dispersive X-ray spectroscopy study of the phase NiSn4

    Electron backscattered diffraction (EBSD) and energy dispersive X-ray spectroscopy (EDS) have been performed on a plate-shaped phase formed through the reaction of Sn and Ni. The phase is formed during extende...

    W. J. Boettinger, M. D. Vaudin, M. E. Williams… in Journal of Electronic Materials (2003)

  2. No Access

    Article

    Observed correlation of Sn oxide film to Sn whisker growth in Sn-Cu electrodeposit for Pb-free solders

    Localized cracking of surface oxide has been proposed as a necessary step in the nucleation of Sn whiskers in Sn electrodeposited films. To evaluate the effects of the oxide film on Sn whisker growth, a bright...

    K. -W. Moon, C. E. Johnson, M. E. Williams, O. Kongstein… in Journal of Electronic Materials (2005)

  3. No Access

    Article

    Hillock and Whisker Growth on Sn and SnCu Electrodeposits on a Substrate Not Forming Interfacial Intermetallic Compounds

    Intermetallic compound (IMC) formation at the interface between the tin (Sn) plating and the copper (Cu) substrate of electronic components has been thought to produce compressive stress in Sn electrodeposits ...

    M.E. Williams, K.-W. Moon, W.J. Boettinger, D. Josell… in Journal of Electronic Materials (2007)

  4. No Access

    Article

    Equi-Axed Grain Formation in Electrodeposited Sn-Bi

    Sn is widely used as a coating in the electronics industry because it provides excellent solderability, ductility, electrical conductivity, and corrosion resistance. However, Sn whiskers have been observed to ...

    E. Sandnes, M.E. Williams, M.D. Vaudin, G.R. Stafford in Journal of Electronic Materials (2008)