Skip to main content

1 Result(s)

within Leilin Huang Remove this filter

and

  1. No Access

    Chapter and Conference Paper

    Groove in Sapphire Machined by CO2 Laser Under Water

    We have demonstrated a method for crack-free machining of groove in sapphire by using a CO2 continuous-wave (CW) laser under water. A sapphire wafer with a thickness of 1 mm is immersed into the water with 1 mm b...

    Leilin Huang, Lei **ao, Fufei Pang… in Proceedings of the 8th International Multi… (2021)