Abstract
We have demonstrated a method for crack-free machining of groove in sapphire by using a CO2 continuous-wave (CW) laser under water. A sapphire wafer with a thickness of 1 mm is immersed into the water with 1 mm beneath the water surface. The effect of laser processing parameters on the jagged edge size and groove depth has been analyzed by tuning line-to-line spacing ranging from 0.006 to 0.1 mm as well as scanning speeds from 5 to 80 mm/s. As the decreasing of line-to-line spacing and the increasing of scanning speed, the jagged edge size reduces. The groove depth is deeper as the increasing of line-to-line spacing and scanning speed. Since underwater laser machining reduces substrate defects originated from heat accumulation from the laser, a groove without recast layer and cracking could be formed in sapphire wafer. The achieved groove in sapphire shows potential application for optical fiber sensing in harsh environments and microfluidic channels in corrosive solutions.
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Acknowledgements
This project was funded by National Key Research and Development Program of China (2016YFF0100600); National Natural Science Foundation of China (Grants 61735009 and 61422507).
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Huang, L., **ao, L., Pang, F., Liu, H., Zeng, X., Wang, T. (2021). Groove in Sapphire Machined by CO2 Laser Under Water. In: Xu, L., Zhou, L. (eds) Proceedings of the 8th International Multidisciplinary Conference on Optofluidics (IMCO 2018). IMCO 2018. Lecture Notes in Electrical Engineering, vol 531. Springer, Singapore. https://doi.org/10.1007/978-981-13-3381-1_6
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DOI: https://doi.org/10.1007/978-981-13-3381-1_6
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