Rare-Earth Implanted MOS Devices for Silicon Photonics
Microstructural, Electrical and Optoelectronic Properties
Article
Flash lamp annealing (FLA) is a non-equilibrium annealing method on the sub-second time scale which excellently meets the requirements of thin-film processing. FLA has already been used in microelectronics, mo...
Article
B20-type MnSi is the prototype magnetic skyrmion material. Thin films of MnSi show a higher Curie temperature than their bulk counterpart. However, it is not yet clear what mechanism leads to the increase of t...
Chapter
This chapter addresses various technical aspects of FLA and starts with the individual FLA tool and flash lamp components, followed by a description of the plasma properties during operation. The section about...
Chapter
This chapter gives an overview where flash lamp annealing is used in semiconductor applications. After a short introduction to defect engineering several use cases in the field of do** are discussed includin...
Chapter
This chapter gives a brief history of thermal treatments in general and flash lamp annealing in particular. It introduces the basic thermodynamic values thermal diffusivity, thermal diffusion length and therma...
Chapter
This chapter discusses a couple of issues which are relevant for process management. Thereby, the main focus is on temperature measurement and temperature simulation. The first section deals with pyrometry as ...
Chapter
This chapter gives a brief overview about flash lamp annealing of non-semiconductor materials, although the line to semiconductors is flexible. The first section is devoted to dielectric thin films with the fo...
Article
Hyperdoped silicon with deep level impurities has attracted much research interest due to its promising optical and electrical properties. In this work, single crystalline silicon supersaturated with titanium ...
Article
The optoelectronic applications of Si are restricted to the visible and near-infrared spectral range due to its 1.12 eV-indirect band gap. Sub-band gap light detection in Si, for instance, has been a long-stan...
Article
A key milestone for the next generation of high-performance multifunctional microelectronic devices is the monolithic integration of high-mobility materials with Si technology. The use of Ge instead of Si as a...
Article
Direct integration of high-mobility III–V compound semiconductors with existing Si-based complementary metal-oxide-semiconductor (CMOS) processing platforms presents the main challenge to increasing the CMOS p...
Chapter
In this paper the advantages and drawbacks of rare earth-implanted MOS structures for optoelectronic applications are investigated. The discussion starts with a short overview of the electroluminescence proper...
Book
Microstructural, Electrical and Optoelectronic Properties