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  1. No Access

    Article

    Effects of Zn and Ga Additions to Suppress PdSn4 Growth at a Solder/Pd Interface Under Current Stressing

    PdSn4 is the major phase formed in the interfacial systems of Pd with lead-free solders. In this study, we examined the interfacial behaviors of the Sn/Pd/Sn system under current stressing of 5000 A/cm2 at 180°C....

    Chao-hong Wang, Kuan-ting Li, Ke-hsing Chen in Journal of Electronic Materials (2018)

  2. No Access

    Article

    Effects of Ga Addition on Interfacial Reactions Between Sn-Based Solders and Ni

    The use of Ga as a micro-alloying element in Sn-based solders can change the microstructure of solder joints to improve the mechanical properties, and even suppress the interfacial intermetallic compound (IMC)...

    Chao-Hong Wang, Kuan-Ting Li in Journal of Electronic Materials (2016)

  3. No Access

    Article

    Metastable CoSn4 formation induced by minor Ga addition and effective suppression effect on the IMC growth in solid-state Sn–Ga/Co reactions

    Solid-state interfacial reactions between Co and Sn-based solders doped with different levels of Ga (0.02 to 0.5 wt%) were investigated. With minor Ga addition of less than 0.05 wt%, the CoSn3 layer was uniformly...

    Chao-hong Wang, Kuan-ting Li, Po-yen Huang in Journal of Materials Science (2016)

  4. No Access

    Article

    Interfacial Microstructure Evolution Between Sn-Zn Solders and Ag Substrate During Solid-State Annealing

    In this study, solid-state interfacial reactions between Ag and Sn-Zn alloys with varying Zn content (0.1 wt.% to 9 wt.%) were investigated at 170°C. The reaction couples were prepared by electroplating Ag on ...

    Chao-hong Wang, Po-yi Li, Kuan-ting Li in Journal of Electronic Materials (2014)