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  1. No Access

    Article

    Minor Ge Addition to Suppress the IMC Growth in Interfacial Reactions of Co with Sn-Ag-Ge and Sn-Ag-Cu-Ge Solders

    This study investigated the effects of minor Ge addition (0.01–0.1 wt%) on the interfacial reactions of Sn-3.5Ag and Sn-3.5Ag-0.5Cu solders (in wt%) with a Co substrate. At the Sn-3.5Ag/Co solder joint, the ma...

    Chao-hong Wang, Ke-Hsing Chen, Jiun-Yu Tsai in Journal of Electronic Materials (2022)

  2. No Access

    Article

    Effects of Zn and Ga Additions to Suppress PdSn4 Growth at a Solder/Pd Interface Under Current Stressing

    PdSn4 is the major phase formed in the interfacial systems of Pd with lead-free solders. In this study, we examined the interfacial behaviors of the Sn/Pd/Sn system under current stressing of 5000 A/cm2 at 180°C....

    Chao-hong Wang, Kuan-ting Li, Ke-hsing Chen in Journal of Electronic Materials (2018)