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within K. -W. Moon Remove this filter Solid State Physics Remove this filter

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  1. No Access

    Article

    Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys

    Sn-rich alloys in the Sn-Ag-Cu system are being studied for their potential as Pb-free solders. Thus, the location of the ternary eutectic involving L, (Sn), Ag3Sn and Cu6Sn5 phases is of critical interest. Phase...

    K. -W. Moon, W. J. Boettinger, U. R. Kattner… in Journal of Electronic Materials (2000)

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    Article

    Observed correlation of Sn oxide film to Sn whisker growth in Sn-Cu electrodeposit for Pb-free solders

    Localized cracking of surface oxide has been proposed as a necessary step in the nucleation of Sn whiskers in Sn electrodeposited films. To evaluate the effects of the oxide film on Sn whisker growth, a bright...

    K. -W. Moon, C. E. Johnson, M. E. Williams, O. Kongstein… in Journal of Electronic Materials (2005)

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    Article

    Hillock and Whisker Growth on Sn and SnCu Electrodeposits on a Substrate Not Forming Interfacial Intermetallic Compounds

    Intermetallic compound (IMC) formation at the interface between the tin (Sn) plating and the copper (Cu) substrate of electronic components has been thought to produce compressive stress in Sn electrodeposits ...

    M.E. Williams, K.-W. Moon, W.J. Boettinger, D. Josell… in Journal of Electronic Materials (2007)