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    Article

    Solidification of Ni-Re Peritectic Alloys

    Differential thermal analysis (DTA) and microstructural and microprobe measurements of DTA and as-cast Ni-Re alloys with compositions between 0.20 and 0.44 mass fraction Re provide information to resolve diffe...

    W. J. Boettinger, D. E. Newbury in Metallurgical and Materials Transactions A (2019)

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    Hillock and Whisker Growth on Sn and SnCu Electrodeposits on a Substrate Not Forming Interfacial Intermetallic Compounds

    Intermetallic compound (IMC) formation at the interface between the tin (Sn) plating and the copper (Cu) substrate of electronic components has been thought to produce compressive stress in Sn electrodeposits ...

    M.E. Williams, K.-W. Moon, W.J. Boettinger, D. Josell in Journal of Electronic Materials (2007)

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    Observed correlation of Sn oxide film to Sn whisker growth in Sn-Cu electrodeposit for Pb-free solders

    Localized cracking of surface oxide has been proposed as a necessary step in the nucleation of Sn whiskers in Sn electrodeposited films. To evaluate the effects of the oxide film on Sn whisker growth, a bright...

    K. -W. Moon, C. E. Johnson, M. E. Williams, O. Kongstein in Journal of Electronic Materials (2005)

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    Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys

    Sn-rich alloys in the Sn-Ag-Cu system are being studied for their potential as Pb-free solders. Thus, the location of the ternary eutectic involving L, (Sn), Ag3Sn and Cu6Sn5 phases is of critical interest. Phase...

    K. -W. Moon, W. J. Boettinger, U. R. Kattner in Journal of Electronic Materials (2000)

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    Article

    Physico-Chemical Characterization of the Coprecipitated Y-Ba-Cu-O Fine Powders

    Y-Ba-Cu-o fine powders were prepared by coprecipitating in the oxalate form from metal nitrates solution. The stoichiometry of metals in the precipitate was adjusted by systematic change of copper nitrate (or ...

    H. M. Jang, K. W. Moon, J. H. Moon, H. S. Shin in MRS Online Proceedings Library (1988)