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Article
Reaction characteristics of the In-15Pb-5Ag solder with a Au/Ni/Cu pad and their effects on mechanical properties
Reaction characteristics of the In-15Pb-5Ag (wt.%) solder with a Au/Ni/Cu pad during reflow soldering and aging treatment were examined. Interfacial reaction during reflow resulted in either an AuIn2 or Ni28In72 ...
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Article
Reliability of composite solder bumps produced by an in-situ process
In an attempt to develop a thermally stable solder system, an in-situ Pb-Sn solder composite reinforced with Cu6Sn5 dispersoids was investigated for its thermal stability. The stability was evaluated mainly by me...
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Article
Interfacial reaction and solder joint reliability of Pb-free solders in lead frame chip scale packages (LF-CSP)
Chip scale packages (CSP) have essential solder joint quality problems, and a board level reliability is a key issue in design and development of the CSP type packages. There has been an effort to eliminate Pb...
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Article
Characteristics of the Sn-Pb eutectic solder bump formed via fluxless laser reflow soldering
In an attempt to develop a fluxless reflow solder bum** process, the effects of processing variables, which include energy input rate and time, and the shape of solder disk on the microstructure of the solde...
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Article
Synthesis and microstructure control of TiA1 via combustion synthesis
The rate-controlling reactions in the combustion synthesis of TiAl were studied using DTA and reaction furnace. It was demonstrated that the rate-controlling reactions vary with the combustion temperature. The...
