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  1. No Access

    Article

    New Failure Mode of Flip-Chip Solder Joints Related to the Metallization of an Organic Substrate

    We report a new failure phenomenon during flip-chip die attach. After reflow, flip-chip bumps were separated between the Al and Ti layers on the Si die side. This was mainly observed at the Si die corner. Tran...

    J. W. Jang, S. J. Yoo, H. I. Hwang, S. Y. Yuk, C. K. Kim… in Journal of Electronic Materials (2015)

  2. No Access

    Article

    Preparation and Microstructural Characterization of Ferroelectric Thin Film PbTiO3 on Si, MgO, and Sapphire Deposited by DC Reactive Multitarget Co-Sputtering.

    PbTiO3 thin films on Si (100) plane were prepared by the DC reactive multitarget cosputtering technique. The film composition and structure were examined as a function of deposition parameters. The crystal struct...

    K.Y. Kim, H.I. Hwang, J.Y. Lee, W.K. Choo in MRS Online Proceedings Library (1991)