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Article
The microstructure of electrodeposited titanium-aluminum alloys
The microstructure of electrodeposited titanium-aluminide alloys containing 3.6 to 24.1 at. pct Ti was studied by transmission electron microscopy. The surface morphology of the deposits showed that they conta...
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Chapter
The Electrodeposition of Aluminum-Niobium Alloys from Chloroaluminate Electrolytes
The electrochemical behavior of niobium in a 52:48 mole ratio AlCl3:NaCl molten salt electrolyte was examined by linear sweep voltammetry, chronoamperometry and chronopotentiometry at 190 °C. Niobium oxidation be...
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Article
Thermal transport through thin films: Mirage technique measurements on aluminum/titanium multilayers
Thermal transport properties of multilayer thin films both normal and parallel to the layers were measured. Al/Ti multilayer films 3 μm thick, with individual layers systematically varied from 2.5 to 40 nm, we...
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Article
Observed correlation of Sn oxide film to Sn whisker growth in Sn-Cu electrodeposit for Pb-free solders
Localized cracking of surface oxide has been proposed as a necessary step in the nucleation of Sn whiskers in Sn electrodeposited films. To evaluate the effects of the oxide film on Sn whisker growth, a bright...
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Article
Equi-Axed Grain Formation in Electrodeposited Sn-Bi
Sn is widely used as a coating in the electronics industry because it provides excellent solderability, ductility, electrical conductivity, and corrosion resistance. However, Sn whiskers have been observed to ...
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Article
Effect of current density and electrolyte concentration on hillock growth from pure bright Sn electrodeposits
The effect of current density and Sn methane sulfonate concentration on hillock density, columnar grain size, crystallographic texture, and residual stress of bright Sn electrodeposits is measured. Correlation...