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  1. No Access

    Article

    Pressureless Silver Sintering of Silicon-Carbide Power Modules for Electric Vehicles

    Pressureless silver (Ag) sintering was optimized at 250°C in vacuum and nitrogen gas atmosphere with silicon carbide (SiC) chips, and silicon nitride active metal-brazed substrates (AMB). A 1200-V/200-A power ...

    Won Sik Hong, Mi Song Kim, Chulmin Oh, Yong** Joo, Youngseok Kim, Kyoung-Kuk Hong in JOM (2020)

  2. No Access

    Article

    Low-Pressure Silver Sintering of Automobile Power Modules with a Silicon-Carbide Device and an Active-Metal-Brazed Substrate

    To improve the efficiency of power modules in environmentally friendly vehicles, silicon-carbide (SiC) chips and silicon-nitride (Si3N4) active metal-brazed (AMB) substrates were bonded by low-pressure silver (Ag...

    Won Sik Hong, Mi Song Kim, Chulmin Oh in Journal of Electronic Materials (2020)

  3. No Access

    Article

    Lifetime Prediction of Electrochemical Ion Migration with Various Surface Finishes of Printed Circuit Boards

    Electrochemical ion migration (ECM) can be generated by the electrochemical reaction between the anodic and cathodic electrodes of an electric circuit in the case of temperature, humidity and applied voltage. ...

    Won Sik Hong, Chulmin Oh in Journal of Electronic Materials (2020)

  4. No Access

    Article

    Effect of oxygen on pressureless silver sintering in a nitrogen atmosphere

    To withstand the high working temperatures of next-generation power devices, bonding technologies have evolved from soldering with low melting point materials to sintering with high melting point materials. To...

    Chulmin Oh, Yoonhwa Choi, Dajung Kim… in Journal of Materials Science: Materials in… (2020)

  5. No Access

    Article

    Silver Sintered Joint Property Between Silicon Carbide Device and Ceramic Substrate for Electric Vehicle Power Module

    Highly reliable sintering technologies operating in extreme conditions are being extensively researched nowadays to improve the efficiency of power modules based on silicon carbide (SiC) devices for use in ele...

    Won Sik Hong, Mi Song Kim, Dajung Kim, Chulmin Oh in Journal of Electronic Materials (2019)

  6. No Access

    Article

    Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics

    To suppress the bonding strength degradation of solder joints in automotive electronics, we proposed a mid-temperature quaternary Pb-free Sn-0.5Cu solder alloy with minor Pd, Al, Si and Ge alloying elements. W...

    Won Sik Hong, Chulmin Oh, Mi-Song Kim, Young Woo Lee… in Journal of Electronic Materials (2016)

  7. Article

    Open Access

    Nano-volcanic Eruption of Silver

    Silver (Ag) is one of the seven metals of antiquity and an important engineering material in the electronic, medical, and chemical industries because of its unique noble and catalytic properties. Ag thin films...

    Shih-kang Lin, Shijo Nagao, Emi Yokoi, Chulmin Oh, Hao Zhang… in Scientific Reports (2016)

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  8. No Access

    Chapter and Conference Paper

    Thermomechanical stress driven Ag direct bonding

    The electronic packaging is being developed in the changing trend from soldering to solderless technology bonding to achieve higher performance of integrated circuits (ICs). Our Ag direct bonding opens a novel...

    Chulmin Oh, Shijo Nagao, Katsuaki Suganuma in Proceedings of the 8th Pacific Rim Interna… (2016)

  9. No Access

    Article

    Bonding copper ribbons on crystalline photovoltaic modules using various lead-free solders

    The requirement for environmentally friendly technology has led to considerable efforts to develop photovoltaic (PV) modules. The copper (Cu) ribbon interconnects of PV modules require alternative bonding mate...

    Chulmin Oh, Ayoung Kim, Juhee Kim… in Journal of Materials Science: Materials in… (2015)

  10. No Access

    Article

    Silver stress migration bonding driven by thermomechanical stress with various substrates

    In recent years, the requirement for environmentally friendly power electronics such as light-emitting diodes and integrated power modules has led to substantial efforts in electronic packaging. The high opera...

    Chulmin Oh, Shijo Nagao, Katsuaki Suganuma in Journal of Materials Science: Materials in… (2015)

  11. Article

    Pressureless Bonding Using Sputtered Ag Thin Films

    To improve the performance and reliability of power electronic devices, particularly those built around next-generation wide-bandgap semiconductors such as SiC and GaN, the bonding method used for packaging mu...

    Chulmin Oh, Shijo Nagao, Katsuaki Suganuma in Journal of Electronic Materials (2014)

    Download PDF (1423 KB)