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  1. No Access

    Article

    Effect of current density and electrolyte concentration on hillock growth from pure bright Sn electrodeposits

    The effect of current density and Sn methane sulfonate concentration on hillock density, columnar grain size, crystallographic texture, and residual stress of bright Sn electrodeposits is measured. Correlation...

    K.-W. Moon, S.-K. Kim, M. E. Williams… in Journal of Applied Electrochemistry (2010)

  2. No Access

    Article

    Equi-Axed Grain Formation in Electrodeposited Sn-Bi

    Sn is widely used as a coating in the electronics industry because it provides excellent solderability, ductility, electrical conductivity, and corrosion resistance. However, Sn whiskers have been observed to ...

    E. Sandnes, M.E. Williams, M.D. Vaudin, G.R. Stafford in Journal of Electronic Materials (2008)

  3. No Access

    Article

    Observed correlation of Sn oxide film to Sn whisker growth in Sn-Cu electrodeposit for Pb-free solders

    Localized cracking of surface oxide has been proposed as a necessary step in the nucleation of Sn whiskers in Sn electrodeposited films. To evaluate the effects of the oxide film on Sn whisker growth, a bright...

    K. -W. Moon, C. E. Johnson, M. E. Williams, O. Kongstein… in Journal of Electronic Materials (2005)

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    Article

    Thermal transport through thin films: Mirage technique measurements on aluminum/titanium multilayers

    Thermal transport properties of multilayer thin films both normal and parallel to the layers were measured. Al/Ti multilayer films 3 μm thick, with individual layers systematically varied from 2.5 to 40 nm, we...

    E. J. Gonzalez, J. E. Bonevich, G. R. Stafford, G. White… in Journal of Materials Research (2000)

  5. No Access

    Article

    The microstructure of electrodeposited titanium-aluminum alloys

    The microstructure of electrodeposited titanium-aluminide alloys containing 3.6 to 24.1 at. pct Ti was studied by transmission electron microscopy. The surface morphology of the deposits showed that they conta...

    G. M. Janowski, G. R. Stafford in Metallurgical Transactions A (1992)