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1. Effect of silicon anisotropy on the stability of thermomigration of linear zones

   New types of instabilities associated with crystal anisotropy during thermomigration of rectilinear and curvilinear (annular) zones under the action...

   Boris M. Seredin, Victor P. Popov, ... Sergey Y. Martyushov in Silicon

   Article 07 March 2024

2. Thermomigration-induced failure in ball grid array solder joint under high current stressing

   In this work, rapid failure of a few minutes was observed in real ball grid array solder joints under high current density (8 × 10 ³ and 1 × 10 ⁴  A cm ⁻² ...

   Peng Liu, Sen Cong, ... ** Wu in Journal of Materials Science

   Article 18 June 2023
   

3. New Applications of Thermomigration in Semiconductor Technologies and Optoelectronics Developments (Review)

   Abstract —

   This review presents promising developments in the use of thermomigration processes to form doped or compositionally modified regions in...

   E. Yu. Buchin, Yu. I. Denisenko in Russian Microelectronics

   Article 01 December 2023
   

4. Unified Mechanics of Metals Under High Electrical Current Density: Electromigration and Thermomigration

   Electromigration and thermomigration are irreversible mass diffusion mechanisms under high current density and high-temperature gradient,...

   Cemal Basaran in Introduction to Unified Mechanics Theory with Applications

   Chapter 2022
   

5. Structural Features and Electrical Properties of Si(Al) Thermomigration Channels for High-Voltage Photoelectric Converters

   Abstract

   The results of a study of the structural features and electrical properties of the end-to-end thermomigration (ThM) of the p -channels of...

   A. A. Lomov, B. M. Seredin, ... A. V. Malibashev in Russian Microelectronics

   Article 01 April 2024
   

6. The Formation and Structure of Thermomigration Silicon Channels Doped with Ga

   Abstract

   Vertical through Si(Ga) p channels are created at 1450 K in c-Si(111) plates by thermomigration of local gallium zones. To this end, a...

   A. A. Lomov, B. M. Seredin, ... I. L. Shul’pina in Technical Physics

   Article 01 March 2021
   

7. Thermomigration behavior of Sn–Bi joints under different substrate

   In this work, the atomic migration behavior in Sn-58Bi solder joints was investigated under the condition of a temperature gradient. The effect of...

   Jun Wu, Kaipeng Wang, ... Mingqing Liao in Journal of Materials Science: Materials in Electronics

   Article 02 March 2022
   

8. Unified Mechanics of Metals under High Electrical Current Density: Electromigration and Thermomigration

   Electromigration and thermomigration are in principal irreversible mass diffusion mechanisms under high current density and high temperature...

   Cemal Basaran in Introduction to Unified Mechanics Theory with Applications

   Chapter 2021
   

9. Structural Perfection and Composition of Gallium-Doped Thermomigration Silicon Layers

   Abstract

   A technique that allows one to form thick thermomigration silicon layers heavily doped with gallium for prospective power electronic devices...

   A. A. Lomov, B. M. Seredin, ... I. L. Shul’pina in Technical Physics Letters

   Article 01 March 2020
   

10. Effect of Thermomigration–Electromigration Coupling on Mass Transport in Cu Thin Films

    Self-induced temperature gradients produced due to passage of electric current through thin film interconnects with bends can be very large, making...

    Nalla Somaiah, Praveen Kumar in Journal of Electronic Materials

    Article 23 September 2019

11. Thermal stability and diffusion barrier performance of amorphous Ni-P layer at Sn/Ni-P/Cu interface

    As chip integration increases and micro-bump size reduces in 3D integrated circuits (ICs), issues with service reliability due to electromigration...

    **ye Yao, Min Shang, ... Zhaoqing Gao in Journal of Materials Science: Materials in Electronics

    Article 06 May 2024
    

12. Controlled growth of single-crystalline metal nanowires via thermomigration across a nanoscale junction

    Mass transport driven by temperature gradient is commonly seen in fluids. However, here we demonstrate that when drawing a cold nano-tip off a hot...

    De-Gang **e, Zhi-Yu Nie, ... Zhi-Wei Shan in Nature Communications

    Article Open access 02 October 2019
    

13. Inhibition of roof-type Cu₆Sn₅ grains on migration of Cu atoms under temperature gradient

    The thermomigration (TM) caused by nonuniform joule heat in micro-solder joints seriously threaten the reliability of electronic device. In this...

    Yuan Li, Lianyong Xu, ... Yongdian Han in Journal of Materials Science

    Article 27 December 2023
    

14. On Thermomigration Velocity of Liquid Cylindrical Inclusions in a Crystal under Stationary Thermal Conditions

    Abstract

    The dependences of the velocity and the cross section shape of the inclusion on the cross sectional area at the various interfacial energy...

    S. I. Garmashov in Physics of the Solid State

    Article 01 December 2019
    

15. Temperature Gradient Induced Orientation Change of Bi Grains in Sn–Bi57–Ag0.7 Solder Joint

    Sn-Bi- X solders are widely used in electronic packaging industry. However, thermomigration (TM) behaviors of Sn-Bi- X solder joints and the...

    Yinbo Chen, Zhaoqing Gao, Zhi-Quan Liu in Acta Metallurgica Sinica (English Letters)

    Article 06 January 2022
    

16. Determination of the Thermodynamic Parameters of Do** Silicon by Means of Thermomigration

    Abstract

    The effect of the Al–Ga melt composition on the mass transfer processes occurring during silicon recrystallization has been investigated by...

    V. V. Kuznetsov, E. R. Rubtsov, B. M. Seredin in Crystallography Reports

    Article 13 December 2018
    

17. Study on Phase Electromigration and Segregation Behavior of Cu-Cored Sn-58Bi Solder Interconnects under Electric Current Stressing

    Cu-cored solder interconnects have been demonstrated to increase the performance of interconnect structures, while the quantitative understanding of...

    Shuibao Liang, Han Jiang, Jiaqiang Huang in Journal of Electronic Materials

    Article Open access 12 December 2023
    

18. Interconnect Quality and Reliability of 3D Packaging

    QualityQuality of 3D packing and reliabilityReliability of 3D packing aspects of 3D IC and packages are discussed in this chapter. The main focuses...

    Yaodong Wang, Yingxia Liu, ... Luhua Xu in 3D Microelectronic Packaging

    Chapter 2021
    

19. Modeling and Experimental Verification of Intermetallic Compounds Grown by Electromigration and Thermomigration for Sn-0.7Cu Solders

    Printed circuit boards that use fine pitch technology have a greater risk of open-circuit failure, due to void formations caused by the growth of...

    Sung-Min Baek, Yu** Park, ... Namhyun Kang in Journal of Electronic Materials

    Article 26 November 2018

20. Localised structuring of metal-semiconductor cores in silica clad fibres using laser-driven thermal gradients

    The molten core drawing method allows scalable fabrication of novel core fibres with kilometre lengths. With metal and semiconducting components...

    Seunghan Song, Fredrik Laurell, ... Ursula J. Gibson in Nature Communications

    Article Open access 13 May 2022