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Low-temperature lead-free SnBiIn solder for electronic packaging
In pursuit of functionality and miniaturization in electronics, 3D integrated packaging requires low-temperature solders. This study explores a novel...
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Comparison of high-speed shear properties of low-temperature Sn-Bi/Cu and Sn-In/Cu solder joints
To study the high-speed shear properties of low-temperature solders, we select four groups of samples of Sn– x Bi ( x = 22, 30 wt%) and Sn− x In alloys ( x ...
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Structure and properties of low-Ag SAC solders for electronic packaging
Since the high cost of Ag, current research on traditional high-Ag solders has gradually shifted to low-Ag solders. However, the microstructure tends...
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Investigation of Sn–Bi–In ternary solders with compositions varying from In–Sn eutectic to 59 °C ternary eutectic point
This study reports on the investigation of the melting behavior and mechanical properties of Sn–Bi–In ternary solders, which has two ternary eutectic...
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Surface Modifications on Ceramic Reinforcement for Tin-Based Composite Solders
This chapter aimed to provide a general overview of several surface modifications’ techniques of ceramic reinforcements on the properties of...
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Thermal, Microstructural, and Mechanical Features of Bi-Containing Sn-1Ag-0.5Cu Lead-Free Solders
This paper describes the impact of bismuth content on the microstructure, thermal, and mechanical characteristics of Sn-1Ag-0.5Cu (SAC105) lead-free...
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Effect of electric current stressing on mechanical performance of solders and solder joints: A review
Mechanical performance is one of the most important factors influencing the reliability of solder joints. Heretofore, plenty of works have been...
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Effects of Near-amorphous multiphase intermetallic compound particles on the microstructure and mechanical properties of SnBi solders
In this study, near-amorphous multiphase intermetallic compound (IMC) particles were prepared with mass percentages of 0, 0.25, 0.5, and 1% to form...
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Composition design, microstructure and mechanical properties of bismuth-doped In–Sn-based low-temperature solder alloy
In-48Sn eutectic solder is an ideal candidate for flexible electronics equipment packaging because of its low melting point (118 °C) and low...
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Strength-enhanced Sn–In low-temperature alloy with surface-modified ZrO2 nanoparticle addition
Low-temperature packaging is essential for the widespread use of flexible electronic devices, and Sn–In eutectic alloys have attracted considerable...
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Intermediate Low-Melting-Temperature Solder Thermal Cycling Enhancement Using Bismuth and Indium Microalloying
In general, Sn-Ag-Cu solder is widely used for interconnections in semiconductor device packaging. However, recently, several factors have been...
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Electrical Resistivity of Lead-Free Solders Reinforced by Carbon Nanospheres
Electrical resistivity of the nanocomposites Sn 96.5 Ag 3 Cu 0.5 and Sn 95,5 Ag 3,8 Cu 0,7 lead-free solder alloys with minor admixtures of carbon nanospheres...
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Direct flip-chip bonding of bare dies to polypropylene-coated paper substrates without adhesives or solders
Paper-based electronics is an emerging concept with the prospect of develo** recyclable, low cost, flexible, and green products such as paper...
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A review on nanodispersed lead-free solders in electronics: synthesis, microstructure and intermetallic growth characteristics
Lead-free solder research has witnessed a great jump in the past decades due to the increased restrictions over the use of toxic lead-bearing solder...
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Low Temperature Diffusion Bonding of Si Chips Sputtered with High Density (111)-Ag Nanotwinned Films
In this study, the microstructural evolution of Ag films with different amounts of (111)-oriented grains and coincident site lattice Σ3 (CSL-Σ3) twin...
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Low-temperature sintering of Ag nanoparticles for high-performance thermoelectric module design
To facilitate the development of thermoelectric modules for various operating temperature ranges, a connection technology that is suitable for...
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Investigation of Sn–Bi–In ternary solders with compositions varying from Sn–Bi eutectic point to 76 °C ternary eutectic
The solder properties of Sn–Bi–In ternary solders of seven different compositions are examined. The compositions are systematically chosen from the...
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Hybrid Solder Joint for Low-Temperature Bonding Application
Low-temperature bonding has become a significant trend in advanced electronics packaging technology. A low-reflow-temperature process can effectively...
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Solid-state diffusion studies of lead-free solders on gold and in polymer films
Lead-free solders are commonly used in microelectronic packages in chip and board level interconnections. They primarily interact with other metals...
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Microstructure and properties of Sn-Ag and Sn-Sb lead-free solders in electronics packaging: a review
Electronic devices need to work at high temperature in some fields for a long time, peculiarly step soldering technology, primary packaging and...
