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Flip Chip Technology
Flip chip technologies have been used extensively for the processors of mainframe computers, servers, personal computers, notebooks, smartphones,...
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Advanced Flip Chip Packaging
Flip Chip (FC) technology has been introduced for over 50 years (by IBM in the early 1960s), which is widely used for electronic packaging due to...
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Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both...
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Flip-Chip III-Nitride LEDs
This chapter introduces the progress of flip-chip LEDs made by our group. The via-hole-based two-level metallization electrodes and highly reflective...
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Numerical investigation on rheology models during encapsulation of moulded underfill (MUF) for flip-chip package
This paper presents a numerical analysis of different rheology models during the encapsulation of moulded underfill (MUF) for flip-chip package....
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High-sensitivity flip chip blue Mini-LEDs miniaturized optical instrument for non-invasive glucose detection
The colorimetric detection of glucose typically involves a peroxidase reaction producing a color, which is then recorded and analyzed. However,...
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Direct flip-chip bonding of bare dies to polypropylene-coated paper substrates without adhesives or solders
Paper-based electronics is an emerging concept with the prospect of develo** recyclable, low cost, flexible, and green products such as paper...
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Preparation and atmospheric wet-reflow of indium microbump for low-temperature flip-chip applications
An urgent demand for lowering bonding temperature has been put forward by advanced flip-chip integration such as micro-LED packaging and...
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Microwave spectroscopy of Andreev states in InAs nanowire-based hybrid junctions using a flip-chip layout
Josephson junctions based on semiconductor nanowires are potential building blocks for electrically tunable qubit structures, e.g., the gatemon or...
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Fractures of ultra-low-k material in a chip during a flip-chip process
The low-k/ultra-low-k (LK/ULK) dielectric materials are incorporated in the 40 nm technology node and beyond to reduce resistance and capacitance...
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A novel approach for flip chip inspection based on improved SDELM and vibration signals
This paper proposes a novel nondestructive diagnostic method for flip chips based on an improved semi-supervised deep extreme learning machine...
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Size Effect on the Electromigration Characteristics of Flip Chip Pb-free Solder Bumps
AbstractTo understand the size effect on electromigration (EM) behavior in flip chip Pb-free Sn-3.5Ag solder bumps, EM tests were performed with...
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Effects of shear test temperatures and conditions on mechanical properties of Sn–Ag flip-chip solder bumps
Lately, as electronic devices are continually becoming smaller, thinner, and multifunctional, there has been a growing demand for highly integrated...
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RDL and Flip Chip Design
RDL, an abbreviation for Redistribution Layer, that is, to make one or more layers of metal on the active chip side to redistribute the pins of the...
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Optimal Design of the Cooled IR Flip-Chip Photodetector
AbstractThe optimal design of a cooled infrared flip-chip photodetector for installation in a cryostat was determined for configurations that either...
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Comparative study of solder joint reliability assessment on fan-out CSP and flip-chip DCA package
The increasing demand over the higher density and smaller form factor of memory packages have become a mainstream due to the boom of artificial...
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P/G Pin Position-Aware Voltage Island Floorplanning For IR Drop Security and avoidance in Flip Chip Designs of FIR Filter
In flip-chip design, voltage drop reduction in the power ground network has become a challenging problem particularly in the modern Multiple Supply...
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Sustainable Pbps Co-packaged Optics Using Passively Assembled, Flip-Chip Evanescent Couplers
A passively assembled chip-to-interposer evanescent coupler between silicon nitride and silicon was experimentally demonstrated with a 0.33 ± 1.03 dB...
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Research on COB-LED light source with tunable CCT based on screen printing and flip chip technology
Based on the fact that flip chip without front-side bonding wire, a correlated color temperature (CCT) tunable chip on board (COB) light emittin g...
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Design of a GaN-Based Flip Chip Light Emitting Diode (FC-LED) with au Bumps & Thermal Analysis with Different Sizes and Adhesive Materials for Performance Considerations
Flip chip (FC) light emitting diodes (LEDs) are considered to be more promising in solid state lighting as compared to wire bonded LEDs. For...