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MEMS Oscillators Revolutionizing the Precision Timing Market
Frequency references are the heartbeat of most electronic systems. Over the last decade, MEMS-based frequency references have revolutionized the...
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On the optimization of molding warpage for wafer-level glass interposer packaging
Through-glass-via (TGV) technology has great potential for various applications in advanced electronic packaging and integrated passive devices due...
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Design and development of broadband DC-10 GHz packaged RF MEMS switches with on chip CPW-microstrip transitions
This paper presents the design, fabrication and packaging of RF MEMS switches that have CPW-converted-to-microstrip RF interface at the die level....
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Fabrication Techniques and Materials for Bio-MEMS
Microelectromechanical systems (MEMS) based advanced point-of-care rapid diagnostic solutions with high degree of sensitivity along with high...
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Effects of PLL Architecture on MEMS Gyroscope Performance
AbstractPhase-Locked Loops (PLL) may be included into modern MEMS gyroscopes to provide excitation of inertial mass oscillations, as well as to form...
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Modelling of air dam** effect on the performance of encapsulated MEMS resonators
The dynamic performance of a micro-resonator depends on its energy loss mechanism which is quantified by Q -factor (Quality factor). This paper...
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Performance Analysis and Simulation of MEMS Capacitive Pressure Sensor
MEMS capacitive pressure sensor has a wide application due to its less power dependency and less sensitive to temperature changes. It also has good...
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Key issues and challenges in device level fabrication of MEMS acoustic sensors using piezo thin films doped with strontium and lanthanum
The development of next-generation piezoelectric micro-electro-mechanical systems (piezo-MEMS) demands reliable and reproducible processes to fulfil...
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Stress concentration-relocating interposer in electronic textile packaging using thermoplastic elastic polyurethane film with via holes for bearing textile stretch
Electronic textile (e-textile) devices require mechanically reliable packaging that can bear up to 30% stretch induced by textile crimp stretch,...
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SoC Packaging
This chapter deals with trends in SOC package designs, packaging processes, types, architectures, criteria for the selection of packages, and their...
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Reliability Analysis of RF MEMS Devices
When radio frequency microelectromechanical system (RF MEMS) based switches appeared more than 25 years ago, micromechanics has attracted huge...
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A Comparative Thermal and Lumen Performance Study of Thin-film Amorphous Silicon Dielectric Coating on Aluminum as an LED Packaging Substrate
Lumen output and efficacy of high-power LEDs have crossed 200 lm/W, and the application of LEDs is growing beyond illumination into other areas like...
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A Digital Twin for MEMS and NEMS
In this chapter we consider a comprehensive, multiphysical digital twin for NEMS and MEMS, in particular, for a range of effects that are currently...
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Exploring the nonlinear piezoresistive effect of 4H-SiC and develo** MEMS pressure sensors for extreme environments
Microelectromechanical system (MEMS) pressure sensors based on silicon are widely used and offer the benefits of miniaturization and high precision....
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TXV Technology: The cornerstone of 3D system-in-packaging
System-in-packaging (SiP) can realize the integration and miniaturization of electronic devices and it is significant to continue Moore’s law....
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A comprehensive modeling of a 6-axis single proof mass MEMS-based piezoelectric IMU
This work reports a comprehensive multiphysics modeling and optimization of a MEMS-based piezoelectric inertial measurement unit (IMU) sensor using a...
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Recycling of Noble Metals Used in Memory Packaging
This Chapter provides an overview of current and future deployment of recycling some noble metals on interconnect metals used in semiconductor...
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Bionic MEMS for Touching and Hearing Sensations: Recent Progress, Challenges, and Solutions
This paper reviews the recent progress on bionic microelectromechanical systems (MEMS) used for touching and hearing sensations, focusing on the...
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Iterative Approach for Low Actuation Voltage RF MEMS Switch
In this paper, we have investigated high isolation and low actuation voltage offering triangular membrane-based shunt capacitive RF MEMS switch....
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State-Of-The-Art of Advanced Packaging
In this chapter, advanced packagingAdvanced packaging is defined. The kinds of advanced packaging are ranked based on their interconnect density and...