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1. Optimized Compound Layer Design for Highly Loaded Nitrided Gears

   Nitriding is a thermochemical surface hardening process, which can be used to improve the performance properties of gears. In particular, the tooth...

   Michaela Sommer, André Sitzmann, ... Stefanie Hoja in Journal of Materials Engineering and Performance

   Article Open access 18 June 2024
   

2. Effect of Mn Addition to Al–Si Alloy on the Layer Formed at the Interface with Cast Iron in Compound Casting

   This study aimed to investigate the effects of adding Mn to a 0.5%Cu-added A356 alloy on the interfacial layer formed between the alloy and cast iron...

   Kyoung-Min Min, Je-Sik Shin, Jeong-Min Kim in International Journal of Metalcasting

   Article 26 March 2023
   

3. Significance of Intermetallic Compound (IMC) Layer to the Reliability of a Solder Joint, Methods of IMC Layer Thickness Measurements

   Intermetallic compound (IMC) growth is being analyzed due to its significant effect on solder joint reliability. It appears that from various works...

   M. A. Bakar, A. Jalar, ... N. Ismail in Recent Progress in Lead-Free Solder Technology

   Chapter 2022
   

4. Microstructural and Phase Evolution Behavior of Compound Layers of Controlled Gaseous Nitrided AISI 1015 Steel

   In this study, the gaseous nitriding was carried out for enhancing surface properties of AISI 1015 steel, and the formation of compound layer was...

   Won-Beom Lee, Taehwan Kim, ... Young-Min Kim in Metallurgical and Materials Transactions A

   Article 13 February 2024
   

5. Interface Embrittlement Between 63Sn-37Pb Solder and Au Layer. Part 2: Quantitative Compositional Analysis of Intermetallic Compound Reaction Layers

   The interface gold (Au) embrittlement failure mode resulting when a Au protective finish is not completely removed by the soldering process. has been...

   P. T. Vianco, A. C. Kilgo, ... S. Williams in Journal of Electronic Materials

   Article 27 October 2022
   

6. Preparation and characterization of solution deposition planarized Y₂O₃–Al₂O₃ compound seed layer for coated conductors

   In this work, we have successfully fabricated the second-generation YBa ₂ Cu ₃ O ₇ (YBCO)-coated conductors on the solution deposition planarization (SDP)...

   Yan Xue, **n Hou, ... Yinxiang Li in Journal of Materials Science: Materials in Electronics

   Article 24 June 2024
   

7. Development of growth model on interfacial intermetallic compound at circular Cu/Sn3.5Ag interface

   The growth model of the interfacial Cu ₆ Sn ₅ compound at the circular Cu/Sn3.5Ag interface has been established in this work. The present developed...

   C. Y. Yeh, J. Y. Wang, ... C. Y. Liu in Journal of Materials Science: Materials in Electronics

   Article 26 October 2022
   

8. Significantly Enhanced Mg/Al Bimetallic Interface by Compound Casting via Combination of Gd Addition and Vibration

   The coarse solidification microstructure and the existence of brittle intermetallic compounds (IMCs) are the main reasons for the poor interface...

   Feng Guan, Wenming Jiang, ... Zitian Fan in Metallurgical and Materials Transactions A

   Article 28 June 2023
   

9. Bond formation between aluminum-based metal matrix composites and aluminum alloys in compound castings

   The use of inserts allows for the selective reinforcement of castings to improve mechanical properties, including surface hardness and wear rate....

   Luke Osvatic, Pablo Zertuche Flores, ... Pradeep Rohatgi in International Journal of Metalcasting

   Article 12 February 2024
   

10. Layer by Layer Self-assembly Fiber-based Flexible Electrochemical Transistor

    Poly(3, 4-ethylenedioxyethiophene)-polystyrene sulfonic acid (PEDOT:PSS)/polyallyl dimethyl ammonium chloride modified reduced graphene oxide...

    Yan Tan, Panpan Hao, ... Yuedan Wang in Journal of Wuhan University of Technology-Mater. Sci. Ed.

    Article 05 July 2024

11. The Effect of Compound Growth on the Microstructure and Properties of Titanium-Steel Clad Plate Subjected to High Temperature Heat Treatment

    To study the effect of interfacial reaction phase growth on the properties of titanium-steel clad plate, the rolled titanium-steel clad plate was...

    **nyuan Pan, ** Jiang, ... Mingya Zhang in Journal of Materials Engineering and Performance

    Article 05 September 2023
    

12. Layer-by-layer chitosan and gold nanoparticles as surface-enhanced Raman scattering substrate

    The layer-by-layer (LbL) method demonstrates significant versatility for constructing substrates with nanoscale-thick layers and diverse...

    Paulo Henrique de Melo Toledo, Linus Pauling de Faria Peixoto, ... Gustavo Fernandes Souza Andrade in Journal of Nanoparticle Research

    Article 05 April 2024
    

13. Properties evaluation of double silane system compound gel as a protective coating on concrete

    Inhibiting moisture transfer at the surface of concrete plays a vital role on the durability of concrete, and permeable protective coating can...

    Xu Chen, Yan Gao, ... Guozhu Liang in Journal of Coatings Technology and Research

    Article 25 September 2023
    

14. Influence of Compound Laser on Paint Removal Depth and Performance of 6005A Aluminum Alloy

    6005A aluminum alloy is widely used in the railway industry due to its excellent performance. Paint removal from the railway surface is an important...

    Qian Zhang, Chunming Wang, ... Jun Wang in Journal of Materials Engineering and Performance

    Article 07 August 2023
    

15. The Structure of Cast Al₂Au Intermetallic Compound with Added Cu

    Abstract

    A mixture of the Al ₂ Au intermetallic compound and copper powders was compacted and then melted in an argon atmosphere to form an Al ₂ Au + Cu...

    E. G. Volkova, B. D. Antonov, ... A. Yu. Volkov in Physics of Metals and Metallography

    Article 01 June 2023
    

16. Scientific analysis of two compound eye beads unearthed in Hejia Village, Zhouling

    The glass compound eye bead is the exquisite embodiment of the glassmaking technology of ancient craftsmen, and is an example of the cultural...

    **gyu Li, Feng Sun, ... Congwen Zhai in Heritage Science

    Article Open access 22 April 2024
    

17. Microstructure evolution and growth kinetics of intermetallic compound in SAC305/Ag and SAC305/Cu solder joints during solid-state aging

    Microstructure evolution and growth kinetics of intermetallic compound (IMC) in Sn-3Ag-0.5Cu (SAC305) /Ag and SAC305/Cu solder joints were...

    Yuanming Chen, Junjie Huang, ... Yan Hong in Journal of Materials Science: Materials in Electronics

    Article 05 February 2024
    

18. Identification of a pseudo-ternary intermetallic compound in the stirred zone of friction-stir-welded 5083 aluminum alloy with 316L steel

    Macrostructure, microstructure, and distribution of phases through the interface were analyzed for friction-stir-welded joints 5083 aluminum alloy...

    Mayerling Martinez Celis, Petr Harcuba, ... Eric Hug in Journal of Materials Science

    Article 10 March 2023
    

19. High-throughput manufacturing of epitaxial membranes from a single wafer by 2D materials-based layer transfer process

    Layer transfer techniques have been extensively explored for semiconductor device fabrication as a path to reduce costs and to form heterogeneously...

    Hyunseok Kim, Yunpeng Liu, ... Jeehwan Kim in Nature Nanotechnology

    Article 20 March 2023
    

20. Porous TiFe₂ intermetallic compound fabricated via elemental powder reactive synthesis

    Porous intermetallics show potential in the field of filtration and separation as well as in the field of catalysis. Herein, porous TiFe ₂ ...

    Qian Zhao, Zhenli He, ... Yao Jiang in International Journal of Minerals, Metallurgy and Materials

    Article 16 April 2024