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The Impact of Bi Content on the Coarsening Kinetics of IMC Particles and Creep Deformation Under Thermal Cycling
This work investigates the impact of Bi content on the microstructure of solder joints under various thermal cycling conditions. Five lead-free...
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The Comprehensive Effect of Electronic Irradiation and Thermal Cycling on the Thermal and Mechanical Properties of Sn-3.0Ag-0.5Cu Solder Joints
The rapid development of aerospace electronics towards lightweight and miniaturized designs has put forward higher requirements for the reliability...
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Deposition, Microstructure and Thermal Cycling Performance of Strain-Tolerant Thermal Barrier Coatings
Thermal barrier coatings (TBCs) with high thermal strain tolerance and erosion resistance are strongly desired in gas turbine engines. Air...
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Thermal Cycling–Electric Current Coupling Damage Mechanisms of SnAgCu/Cu Solder Joints Under Different Temperature Ranges
In this study, in situ investigation of the coupling damage mechanisms of SnAgCu/Cu solder joints under thermal cycling and current was carried out...
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Effect of Thermal-cold Cycling Treatment on Mechanical Properties and Microstructure of 6061 Aluminum Alloy
The influence of thermal-cold cycling treatment on mechanical properties and microstructure of 6061 aluminum alloy was investigated by means of...
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Accelerating structural relaxation of shear band at ambient conditions through cryogenic thermal-cycling
Cryogenic thermal-cycling (CTC) is a promising method for the rejuvenation of metallic glasses (MGs). Although seemingly arbitrary, the direction of...
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Undissolved gold in fine-pitch BGA solder joint under thermal cycling test
Crack propagation has been observed on the bulk solder area of the reworked fine-pitch ball grid array component with the solder joint type SAC305...
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Effect of Thermal Cold Cycling on the Microstructure and Properties of Al–Cu–Mg–Ag Alloy
To study the effect of thermal cold cycling on the microstructure and properties of Al–Cu–Mg–Ag alloy, hardness and tensile tests, resistivity tests,...
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Intermediate Low-Melting-Temperature Solder Thermal Cycling Enhancement Using Bismuth and Indium Microalloying
In general, Sn-Ag-Cu solder is widely used for interconnections in semiconductor device packaging. However, recently, several factors have been...
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Effects of Sn-Ag-x leveling layers on the microstructure and shear behavior of Sn-58Bi solder joint under thermal cycling
Four Sn-Ag-x (Sn-3.0Ag-0.5Cu, Sn-0.3Ag-0.7Cu, Sn-0.3Ag-0.7Cu-0.5Bi-0.05Ni, and Sn-3.0Ag-3.0Bi-3.0In) leveling layers were coated on Cu substrate to...
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Insights into relationship between mechanical behavior and microstructure evolution of Sn-1.0Ag-0.5Cu-GNSs/Cu joint during thermal cycling
With electronic devices progressing into more miniaturized and intelligent, thermal cycling reliability of solder joint has always been an issue in...
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Effect of Micro-structural Dispersity of SiMo Ductile Iron on Thermal Cycling Performance
High alloyed by silicon and molybdenum (SiMo) ductile iron is a common material used for car exhaust systems, and its micro-structural dispersity...
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Effect of Cryogenic Thermal Cycling on Tribocorrosion Performance of Fe-Based Bulk Amorphous Alloy in 3.5 Pct NaCl Solution
The effects of cryogenic thermal cycling on the tribocorrosion behavior of Fe 41 Co 7 Cr 15 Mo 14 C 15 B 6 Y 2 bulk amorphous alloy were studied in 3.5 pct NaCl...
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The Effect of Thermal Quench Cycling on the Stability and Heat Transfer Characteristics of Transesterified-Epoxidized Used Cooking Oil Blended Quench Medium
Mineral oil is a widely used quench media in the heat treatment industries. They are derived from petroleum crude oil, and are toxic, and...
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Optimization of Dwell and Ramp Times for SAC305 Solder Thermal Cycling Fatigue Life for Testing and Real-Life Applications
This paper presents solder joint thermal cycling fatigue life analysis and optimization study using finite element analysis (FEA) and design of...
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Investigation of the Degradation of the Membrane Electrode Assembly for a Proton Exchange Membrane Water Electrolyzer by Accelerated Stress Tests
Abstract—Proton exchange membrane (PEM) water electrolysis allows the production of green hydrogen using renewable but unstable energy sources such...
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The heterogeneous nature of mechanically accelerated grain growth
While grain growth is traditionally viewed as a purely thermally driven process, nanocrystalline metals can undergo grain growth under mechanical...
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New Materials for Thermal Barrier Coatings: Design, Manufacturing and Performance
Ceramic thermal barrier coatings (TBCs) are aimed to protect the surface of metallic components of turbine engines exposed to extreme temperature as...
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Impact of Thermal Cycling on Cu Press-Fit Connector Pin Interconnect Mechanical Stability
Press-fit technology provides an electrical and mechanical connection by inserting a press-fit pin into a through-hole of a printed circuit board...
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Multilayered Coatings by Thermal Spray for High-Temperature Applications
Thermal Barrier Coatings (TBCs) play an increasingly vital role in improving efficiency and performance of high-temperature components in energy and...