Search

Search Results

1. Low-temperature lead-free SnBiIn solder for electronic packaging

   In pursuit of functionality and miniaturization in electronics, 3D integrated packaging requires low-temperature solders. This study explores a novel...

   Shannan Zhang, Weimin Long, ... Tianran Ding in Journal of Materials Science: Materials in Electronics

   Article 02 April 2024
   

2. Recent Progress in Lead-Free Solder Technology Materials Development, Processing and Performances

   This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances....

   Mohd Arif Anuar Mohd Salleh, Mohd Sharizal Abdul Aziz, ... Mohd Izrul Izwan Ramli in Topics in Mining, Metallurgy and Materials Engineering

   Book 2022
   

3. The Influence of Nickel Addition on Properties of Sn–4.0Zn–0.7Cu Lead-Free Solder

   Abstract

   This research investigated changes in the properties of Sn–4.0Zn–0.7Cu (SZC407) solder alloy after do** with 0.5 wt % Ni. Specimens of...

   Panisara Sukhontapatipak, Phairote Sungkhaphaitoon in Physics of Metals and Metallography

   Article 29 December 2023
   

4. Measurement of Mixing Enthalpies for Sn-Bi-Sb Lead-Free Solder System

   Predictions of the thermodynamic behavior of higher-order multicomponent alloys from thermodynamic data of binary and ternary systems have been...

   Vikrant Singh, Dileep Pathote, ... C. K. Behera in Journal of Electronic Materials

   Article 11 July 2023
   

5. Metal deposited nanoparticles as “bridge materials” for lead-free solder nanocomposites

   An influence of carbon nanotubes and carbon nanospheres coated by Au–Pd and Pt on the microstructure of solder/copper joints at room temperature and...

   Yuriy Plevachuk, Peter Švec Sr, ... Alexander Rud in Applied Nanoscience

   Article Open access 07 July 2023
   

6. Synthesis and characterization of Sn–Cu/SiO_2(np) lead-free nanocomposite solder through angular accumulative extrusion

   This study synthesized Sn-0.7wt.%Cu/Xwt.%SiO ₂ nanocomposite solder by angular accumulative extrusion (AAE). AAE is a severe plastic deformation...

   Ali Karimi, Ali Maleki, ... Behzad Niroumand in Journal of Materials Science: Materials in Electronics

   Article 01 July 2023
   

7. Divide and conquer: Machine learning accelerated design of lead-free solder alloys with high strength and high ductility

   The attainment of both high strength and high ductility is always the goal for structure materials, because the two properties generally are mutually...

   Qinghua Wei, Bin Cao, ... Tong-Yi Zhang in npj Computational Materials

   Article Open access 23 October 2023
   

8. Study on Electromigration Mechanism of Lead-Free Sn3.5Ag0.5Bi8.0In Solder Joints

   The electromigration mechanism of linear Cu/Sn3.5Ag0.5Bi8.0In/Cu and Cu/Sn3.0Ag0.5Cu/Cu solder joints has been systematically studied. The crystal...

   **g Han, Heng Cao, ... Ting Wang in Journal of Electronic Materials

   Article 27 November 2022
   

9. Calorimetric measurements of Ga–In, Ga–Sn, and In–Sn binary alloy systems as sustainable lead-free solder alternatives

   The main objective in exploring a lead-free solder system comprising Gallium, Indium, and Tin lies in the desire to mitigate health hazards related...

   Vikrant Singh, Dileep Pathote, ... C. K. Behera in Journal of Materials Science: Materials in Electronics

   Article 04 November 2023
   

10. Effect of Ag₃Sn on Fracture Behaviors of Sn-3.5Ag Lead-Free Solder during In Situ Tensile Test at Low Temperature

    In situ tensile tests on Sn-3.5Ag lead-free solder were performed with different rates of 10  μ m/s and 300  μ m/s at − 198 °C liquid nitrogen...

    **angxi Zhao, Wei Zhang, ... Yanhong Tian in Journal of Materials Engineering and Performance

    Article 31 July 2023
    

11. Microstructural, thermal and mechanical properties of Co added Sn–0.7Cu lead-free solder alloy

    This study investigated the effects of cobalt microalloying addition on the microstructural features, thermal characteristics and mechanical behavior...

    A. M. El-Taher, H. M. Abd Elmoniem, S. Mosaad in Journal of Materials Science: Materials in Electronics

    Article Open access 21 February 2023
    

12. Study on the effects of Ag addition on the mechanical properties and oxidation resistance of Sn–Zn lead-free solder alloy by high-throughput method

    Sn–Zn lead-free solder alloy is seriously restricted in the applications of electronic equipment and circuit boards due to the poor wettability and...

    Fang Li, Cunji Pu, ... Jiatao Zhang in Journal of Materials Science: Materials in Electronics

    Article 31 January 2023
    

13. Effects of Bi Addition on the Solderability and Mechanical Properties of Sn-Zn-Cu Lead-Free Solder

    In the present work, the effects of Bi addition on the microstructure, solderability, and mechanical properties of Sn-Zn-Cu lead-free solder were...

    Cunji Pu, Jialong Qiu, ... Jianhong Yi in Journal of Electronic Materials

    Article 16 June 2022
    

14. Simulation and Prediction of Creep Rate, Activation Energy, and Rupture Time of Sn94Sb5Ag1 Lead-Free Solder Alloy Using Artificial Neural Network Modeling

    In the design of modern microelectronic packaging, solder joint reliability is crucial. The assessment of advanced packaging and the adoption of...

    H. I. Lebda, D. M. Habashy, M. M. Mousa in Journal of Electronic Materials

    Article 02 July 2024
    

15. Robust effects of In, Fe, and Co additions on microstructures, thermal, and mechanical properties of hypoeutectic Sn–Zn-based lead-free solder alloy

    This study examines the influence of separate and dual minor alloying additions of indium (In) and ferrous/cobalt (Fe/Co) on the microstructure,...

    A. M. El-Taher, S. A. Mansour, I. H. Lotfy in Journal of Materials Science: Materials in Electronics

    Article Open access 21 February 2023
    

16. The effect of Ge on the microstructure, thermal behavior, and mechanical properties of lead-free Sn-5Sb-0.7Cu solder alloy

    Nowadays, the development and improvement of physical and mechanical properties of lead-free solders have become a topic of interest for researchers,...

    Hoda Pooshgan, Homam Naffakh-Moosavy in Journal of Materials Science: Materials in Electronics

    Article 07 January 2023
    

17. Interface behavior and performance of Sn–Ag–Cu lead-free solder bearing Tb

    To further improve the performance of the Sn–3.5Ag–0.5Cu solder, trace amount of rare earth Tb was added. The wettability, shear strength and...

    Zeyu Yuan, Yujie He, ... Huiming Chen in Journal of Materials Science: Materials in Electronics

    Article 20 August 2022
    

18. Recent Studies in the Development of Ceramic-Reinforced Lead-Free Composite Solder

    Until today, there have been abundant research studies conducted by various researchers to improve the existing lead-free solders’ properties with...

    Norainiza Saud, Mohd Arif Anuar Mohd Salleh, ... Mohd Izrul Izwan Ramli in Recent Progress in Lead-Free Solder Technology

    Chapter 2022
    

19. Manufacturing and characterization of Sn–Cu/SiO_2np lead-free nanocomposite solder by accumulative roll bonding (ARB) process

    In this study, lead-free Sn-0.7 wt% Cu and Sn-0.7 wt% Cu/1 wt% SiO _2np nanocomposite solders were manufactured using vacuum melting and accumulative...

    Milad Hosseini, Behzad Niroumand, ... Hasan Kaser Issa in Journal of Materials Science: Materials in Electronics

    Article 16 May 2022
    

20. Wettability and Rheological Behavior of Low Ag Lead-Free SAC/Graphene and Cobalt-Graphene Nanocomposite Solder Paste

    The impacts of dopant nanoparticles, graphene nanosheets (GNSs) and cobalt decorated-graphene nanosheets (CoGNSs), were studied in relation to the...

    M. Tamizi, M. Movahedi, ... S. Azghandi Rad in Metallurgical and Materials Transactions A

    Article 11 May 2022