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Manufacturing and characterization of Sn–Cu/SiO2np lead-free nanocomposite solder by accumulative roll bonding (ARB) process

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Abstract

In this study, lead-free Sn-0.7 wt% Cu and Sn-0.7 wt% Cu/1 wt% SiO2np nanocomposite solders were manufactured using vacuum melting and accumulative roll bonding (ARB) processes. Microstructural investigations and differential scanning calorimetry showed successful vacuum melting and alloying of the solder. The results showed that performing six ARB passes with 75% reduction per pass, without any lubrication or surface preparation procedures, resulted in a relatively uniform distribution of the nanoparticles in the matrix. Optimum nanocomposite solder revealed a 30% and 70% increase in microhardness and tensile strength compared to the monolithic sample, respectively. The shear strength of the optimum nanocomposite solder after reflow was about 20% higher than the monolithic solder. Also, there was no significant change in the wetting angle of the optimum nanocomposite solder with a copper substrate compared with the monolithic sample. The electrical resistivity measurements showed that the optimal nanocomposite solder has the desired performance during application. The results approve the applicability of the studied Sn–Cu–SiO2np nanocomposite and ARB process for the economical production of a reliable lead-free solder in the electronics industry.

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Acknowledgements

This research has been supported by Iran National Science Foundation (INSF) and conducted at the Isfahan University of Technology.

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Authors and Affiliations

  1. Department of Materials Engineering, Isfahan University of Technology, Isfahan, 84156-83111, Iran

    Milad Hosseini, Behzad Niroumand & Hasan Kaser Issa

  2. Department of Mechanical Engineering, Isfahan University of Technology, Isfahan, 84156-83111, Iran

    Ali Maleki

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  1. Milad Hosseini
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MH performed the experiments and prepared the paper draft. HKI assisted in analysis of the results. BN and AM supervised the research and corrected the draft as the final version.

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Correspondence to Ali Maleki.

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Hosseini, M., Niroumand, B., Maleki, A. et al. Manufacturing and characterization of Sn–Cu/SiO2np lead-free nanocomposite solder by accumulative roll bonding (ARB) process. J Mater Sci: Mater Electron 33, 13516–13530 (2022). https://doi.org/10.1007/s10854-022-08286-7

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