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Hybrid Solder Joint for Low-Temperature Bonding Application
Low-temperature bonding has become a significant trend in advanced electronics packaging technology. A low-reflow-temperature process can effectively...
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Finite Element Simulation of Sn-Ag-Cu Solder Joint Reliability Under Thermoelectric Coupling
As an important component of electronic packaging, the failure of lead-free solder joints will seriously affect the reliability of packaging. The...
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Electromigration behavior of Sn–3.0Ag–0.5Cu/Sn–37Pb hybrid solder joints with various mixed percentages for aerospace electronics
The microstructural evolution and failure mode of Sn–3.0Ag–0.5Cu (SAC305)/Sn–37Pb hybrid ball grid array solder joints with various mixed percentages...
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Hybrid solder joints: the effect of nanosized ZrO2 particles on morphology of as-reflowed and thermally aged Sn–3.5Ag solder joints
The main number of current researches has been focused on the microstructure and mechanical properties of the Sn-based Sn–Ag–Cu-based solders, while...
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The In-Situ TEM Isothermal Aging Evolution in a µ-Cu/NiAu/Sn/Cu Solder Joint for Full Intermetallic Compounds Interconnects of Flexible Electronics
A structure composed of various Cu–Ni–Sn IMCs would develop from severe Joule heat and excessive elemental diffusion under high-density current in...
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Effect of pre-soldering temperatures on the microstructures and shear behaviors of SnBi-SAC/ENIG solder joints
Thermal deformation during soldering between the chip and the substrate is an important factor affecting the quality of high-density packaging of...
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Development of carbonaceous tin-based solder composite achieving unprecedented joint performance
Weight reduction and improved strength are two common engineering goals in the joining sector to benefit transport, aerospace, and nuclear industries...
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Microstructures and shear strengths of W-ball solder joints aged under isothermal and cyclic thermal conditions
The thermal reliability, which results from CTE (coefficient of thermal expansion) mismatch among packaging materials, is essential to BGA (ball grid...
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Review of ultrasonic-assisted soldering in Sn-based solder alloys
Sn-based lead-free solder has been widely applied in areas like electronic packaging due to its excellent solderability. The composite solders can be...
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Development of Geopolymer Ceramic-Reinforced Solder
This chapter aims to provide a general understanding of the geopolymer usage as a ceramic reinforcement material in the solder alloy. The metal...
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Board-level drop reliability and fracture behavior of low-temperature soldering Sn–Ag–Cu/Sn–Bi–X hybrid BGA solder joints for consumer electronics
Low-temperature soldering technology (185–195 °C) is applied for assembling consumer electronics with various Bi contents, and board-level drop...
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Recent Progress in Transient Liquid Phase (TLP) Solder for Next Generation Power Electronics
There has been an increasing demand for more reliable high-temperature resistant solder joints in recent years. Develo** a reliable...
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Flux Modification for Wettability and Reliability Improvement in Solder Joints
Flux is essential in the soldering process. Regardless of the solder materials, soldering process types, and classifications, fluxes are essential...
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Thermomechanical Fatigue Damage Model of a Solder Joint in Electronic Devices: An Interval Arithmetic Based Approach
This paper presents a new opened-up reliability assessment framework and demonstrates the feasibility of using interval arithmetic by considering...
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Evaluation of Shear Properties of Indium Solder Alloys for Cryogenic Applications
In this work, different indium solder alloys were developed and characterized for their shear properties to find out their suitability for cryogenic...
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Influence of Pad Surface Finish on the Microstructure Evolution and Intermetallic Compound Growth in Homogeneous Sn-Bi and Sn-Bi-Ag Solder Interconnects
Low reflow temperature solder interconnect technology based on Sn-Bi alloys is currently being considered as an alternative for Sn-Ag-Cu solder...
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Analytical Fatigue Life Prediction of Ball Grid Array Solder Joints
This study evaluates the applicability of rapid life prediction methods of integrated circuit packages. Although computing power is becoming less of...
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Improvement of mechanical property on TC17 welded joints with backing plates by TIG + brazing hybrid welding
TIG welding is used for TC17 titanium alloy butt welding with backing plates. The silver-based brazing materials as interlayer is applied and a...
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Microstructure evolution and shear behavior of Pb–16Sn–7.5Sb–xAg/Cu joints
The aerospace industry requires a reliable solder with a melting point of about 240 °C that does not produce tin whiskers. The Pb–16Sn–7.5Sb-based...
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Recent Studies in the Development of Ceramic-Reinforced Lead-Free Composite Solder
Until today, there have been abundant research studies conducted by various researchers to improve the existing lead-free solders’ properties with...