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1. Joule-Heating-Induced Damage in Cu-Al Wedge Bonds Under Current Stressing

   Copper wires are increasingly used to replace gold wires in wire-bonding technology owing to their better electrical properties and lower cost....

   Tsung-Han Yang, Yu-Min Lin, Fan-Yi Ouyang in Journal of Electronic Materials

   Article 17 October 2013

2. Assessment of energy dissipation mechanisms for AT-cut QCM sensors with high frequency impedance analysis and optimization heuristics

   In the present contribution, five unloaded AT-cut quartz crystal microbalance (QCM) sensors with nominal resonant frequencies equal to 5, 5.2 and...

   Athanasios Kakalis, Costas Panayiotou in Journal of Electroceramics

   Article 19 February 2013
   

3. Thermomigration of Cu–Sn and Ni–Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints

   Thermomigration in Pb-free SnAg solder alloys is investigated during accelerated electromigration tests under 9.7 × 10 ³ A/cm ² at 150 °C. It is found...

   Hsiao-Yun Chen, Chih Chen in Journal of Materials Research

   Article 01 April 2011
   

4. The Stressing Effect of Electromigration from the Maxwell Stress and a Preliminary Mean-Time-to-Failure Analysis

   As temperature increases, it is suggested that atoms on lattice sites serve as dynamic defects and cause a much more homogeneous distribution of the...

   Peng Zhou in Journal of Electronic Materials

   Article 23 February 2013

5. Cu₅Zn₈ Growth Reversion in Cu/Sn-8Zn-3Bi/Cu During Discontinuous Electromigration

   A Cu/Sn-8Zn-3Bi/Cu structure was used to investigate the intermetallic compound (IMC) growth behavior during discontinuous electromigration under...

   Jibin Liu, Wei Zhou, ... ** Wu in Journal of Electronic Materials

   Article 31 May 2012

6. Surface Morphology of Sn-Rich Solder Interconnects After Electrical Loading

   Morphological changes from electromigration were examined on microsized Sn-Ag-Cu, pure Sn, and single-crystal Sn solder interconnects. It was found...

   Q. S. Zhu, H. Y. Liu, ... J. K. Shang in Journal of Electronic Materials

   Article 17 February 2012

7. Thermodynamics and Diffusion Coupling in Alloys—Application-Driven Science

   As emphasized by Stokes (1997), the common assumption of a linear progression from basic research (science), via applied research, to technological...

   John Ågren in Metallurgical and Materials Transactions A

   Article Open access 31 August 2011
   

8. Effects of Surface Finishes and Current Stressing on Interfacial Reaction Characteristics of Sn-3.0Ag-0.5Cu Solder Bumps

   The effects of surface finishes on the in situ interfacial reaction characteristics of ball grid array (BGA) Sn-3.0Ag-0.5Cu lead-free solder bumps...

   Jae-Myeong Kim, Myeong-Hyeok Jeong, ... Young-Bae Park in Journal of Electronic Materials

   Article 25 January 2012

9. Thermomigration and electromigration in Sn8Zn3Bi solder joints

   Individual effect of thermomigration (TM) and combined effect of TM and electromigration (EM) on the microstructural variation in Sn8Zn3Bi was...

   X. Gu, K. C. Yung, ... D. Yang in Journal of Materials Science: Materials in Electronics

   Article 18 April 2010
   

10. Current-induced interfacial reactions in Ni/Sn–3Ag–0.5Cu/Au/Pd(P)/Ni–P flip chip interconnect

    The current-induced interfacial reactions in the Ni/Sn-3.0Ag-0.5Cu/Au/Pd(P)/Ni–P (ENEPIG) flip chip interconnects and the failure mechanism during...

    M.L. Huang, S. Ye, N. Zhao in Journal of Materials Research

    Article 01 December 2011
    

11. Influence of indium addition on electromigration behavior of solder joint

    The electromigration (EM) behavior of the Cu/Sn-In/Cu solder model strip was investigated under the conditions of high electrical current density (10...

    Kiju Lee, Keun-Soo Kim, Katsuaki Suganuma in Journal of Materials Research

    Article 01 October 2011
    

12. Field Assisted Sintering Mechanisms

    Field assisted sintering studies have produced a wealth of data about the densification behaviors of many powder systems. However, the sheer volume...

    U. Anselmi-Tamburini, G. Spinolo, ... A. K. Mukherjee in Sintering

    Chapter 2012
    

13. Direct measurement of hot-spot temperature in flip-chip solder joints with Cu columns under current stressing using infrared microscopy

    In this study, the temperature map distribution in the Sn3.0Ag0.5Cu solder bump with Cu column under current stressing is directly examined using...

    Yu-Chun Liang, Chih Chen, D. J. Yao in MRS Online Proceedings Library

    Article 01 August 2010

14. Electronic Behavior of Ba_0.5Sr_0.5Co_0.8Fe_0.2O_3-d and SrCo_0.9Nb_0.1O_3-d

    The perovskite Ba _0.5 Sr _0.5 Co _0.8 Fe _0.2 O _3-d (BSCF 5582) has attracted great interest as an oxygen reduction catalyst for solid oxide fuel cells and as an...

    Robert E. Usiskin, Richard Y. Wang, Sossina M. Haile in MRS Online Proceedings Library

    Article 01 May 2011

15. A Diffuse Interface Model of Intermediate-Phase Growth Under the Influence of Electromigration

    A diffuse interface model has been developed to investigate intermediate-phase growth in a binary two-phase system under the influence of...

    Peng Zhou, William C. Johnson in Journal of Electronic Materials

    Article 02 July 2011

16. A Sharp Interface Model of Intermediate-Phase Growth Under the Influence of Electromigration

    A sharp interface model has been developed to model intermediate-phase growth under the influence of electromigration in a binary system. Simulation...

    Peng Zhou, William C. Johnson, Perry H. Leo in Journal of Electronic Materials

    Article 30 June 2011

17. Thermomigration and electromigration in Sn58Bi ball grid array solder joints

    In the present study, individual effect of thermomigration (TM) and combined effects of TM and electromigration (EM) in Sn58Bi ball grid array (BGA)...

    X. Gu, K. C. Yung, Y. C. Chan in Journal of Materials Science: Materials in Electronics

    Article 13 October 2009
    

18. Detector-grade CdZnTe:In crystals obtained by annealing

    A method for successfully obtaining detector-grade CdZnTe:In (CZT:In) crystals by annealing is described in this article. Pure Te is used as...

    Pengfei Yu, Wanqi Jie, Tao Wang in Journal of Materials Science

    Article 26 January 2011
    

19. A review on the interfacial intermetallic compounds between Sn–Ag–Cu based solders and substrates

    The objective of this review is to study the interfacial intermatallic compounds (IMCs) between Sn–Ag–Cu based solders and common substrates, which...

    Guang Zeng, Songbai Xue, ... Jiadong Luo in Journal of Materials Science: Materials in Electronics

    Article 06 March 2010
    

20. Formation of Elemental Distribution in Glass using Thermal Accumulation with Femtosecond Laser Irradiation

    Elemental migration inside a glass was induced space-selectively and microscopically by high-repetition femtosecond(fs) laser irradiation. The...

    M. Shimizu, K. Miura, ... K. Hirao in MRS Online Proceedings Library

    Article 01 December 2009