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1. Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compound (IMC) Growth in Solder Joints

   Printed circuit board (PCB) is widely used in electronic packaging and plays a role in supporting the electronic components by providing electrical...

   A. Atiqah, A. Jalar, ... N. Ismail in Recent Progress in Lead-Free Solder Technology

   Chapter 2022
   

2. Molecular Dynamic of the Nanoparticle Reinforcement in the Pb-Free Solder During Reflow Soldering Process

   Nano-reinforcement in Pb-free solder has emerged as a potential alternative to improve lead-free solder’s mechanical and physical properties. With...

   Mohd Sharizal Abdul Aziz, I. N. Sahrudin, ... Mohd Arif Anuar Mohd Salleh in Recent Progress in Lead-Free Solder Technology

   Chapter 2022
   

3. Orientation transformation of Cu₆Sn₅ grains by Ag addition in Cu/Sn-xAg/Cu micro solder joints under temperature gradient

   Cu ₆ Sn ₅ intermetallic compound (IMC), which occupies most even full of solder joints bringing by the reduced size of interconnection and the...

   Yuanyuan Qiao, Hongwei Liang, Ning Zhao in Journal of Materials Science

   Article 27 February 2023
   

4. Application of Ag-Cu-Ti active metal composite filler in ceramic joining: a review

   As a structural and functional material with excellent properties, ceramics play an extremely important role in a wide range of industries, including...

   Yuhang Li, Jun Wang, ... Lin Zhang in Frontiers of Materials Science

   Article 16 October 2023

5. Recent advances on SnBi low-temperature solder for electronic interconnections

   SnBi lead-free solder is widely applied in the field of low-temperature soldering due to its excellent creep resistance, relatively low melting point...

   Nan Jiang, Liang Zhang, ... Peng He in Journal of Materials Science: Materials in Electronics

   Article 26 August 2021
   

6. The Fabrication of Ni-MWCNT Composite Solder and Its Reliability Under High Relative Humidity and Temperature

   Ni decorated multi-walled carbon nanotube (Ni-MWCNT) composite solders have been fabricated using Ni-MWCNT composite materials and Sn58Bi solder...

   Choong-Jae Lee, Kyung Deuk Min, ... Seung-Boo Jung in Journal of Electronic Materials

   Article 05 September 2020

7. Microstructure and mechanical properties of Ag nanoparticles-modified Sn–58Bi/Cu solder joints during liquid-state reaction

   Alloying various elements into the solders or the Cu substrate has been conducted to prevent embrittlement of Sn–Bi/Cu solder joints, caused by Bi...

   Dae-Young Park, Jungsoo Kim, ... Yong-Ho Ko in Journal of Materials Science: Materials in Electronics

   Article 22 October 2021
   

8. Microstructural, compositional and hardness evolutions of 96.5Sn–3Ag–0.5Cu/TiC composite solder under thermo-migration stressing

   A 96.5Sn3Ag0.5Cu (SAC305) lead-free composite solder containing 0.1 wt% titanium carbide (TiC) was prepared using the powder metallurgy method and a...

   Guang Chen, **nzhan Cui, ... Fengshun Wu in Journal of Materials Science: Materials in Electronics

   Article 02 May 2020
   

9. Structural Analysis of the Interface of Contact Melting between AMg6 and Zn-Based Alloys

   Abstract

   We study the processes of the contact melting of AMg6 alloy with a solid Zn–Cu–Al solder and a model Zn–Al alloy, as well as the structure of...

   E. A. Batalova, L. V. Kamaeva, ... M. D. Krivilev in Journal of Surface Investigation: X-ray, Synchrotron and Neutron Techniques

   Article 01 April 2024
   

10. Properties, Macro- and Microstructure of a Layered Structural Element Based on Inorganic Glass and a Steel — Glass-and-Metal Composite Rod

    Glass-and-metal composite is a new layered composite material made of inorganic glasses and steel (or aluminum). Currently technology is being...

    O. N. Lyubimova, A. V. Morkovin, M. V. Barbotko in Metallurgist

    Article 01 January 2023
    

11. Study on the Interface of Molybdenum Foil-copper Explosive-welded Composite Plate

    Molybdenum–copper composites were developed as heat sink materials. In order to reduce the amount of molybdenum used in the composite material, the...

    Zhixiong Bi, Xuejiao Li, ... Yong Wu in Transactions of the Indian Institute of Metals

    Article 04 February 2023
    

12. Electrochemical deposition of Sn-0.7Cu alloy modified with nano-WO₃ for high-density mini-LED packaging

    In this work, Sn-0.7Cu-WO ₃ nanomodified solders were electrodeposited from an aqueous acidic plating bath containing various fractions of WO ₃ ...

    Gyeong Ah Lee, Ashutosh Sharma, Jae Pil Jung in Journal of Materials Science: Materials in Electronics

    Article 13 May 2024
    

13. Effect of Doped Nano-Ni on Microstructure Evolution and Mechanical Behavior of Sn-3.0Ag-0.5Cu (SAC305)/Cu-2.0Be Solder Joint during Isothermal Aging

    The Cu-2.0Be alloy is widely used as the substrate in the aircraft electronic device, which has a potential trend to replace the pure Cu substrate....

    Zuozhu Yin, Mei Lin, ... Ziyuan Wu in Journal of Materials Engineering and Performance

    Article 13 May 2020
    

14. Study of the Influence of the Chemical Composition of Aluminium Solders on the Bonding Strength of Brazed Titanium Structures

    Abstract

    Studies of the processes of wetting and spreading of silicon-doped aluminium on titanium under the conditions of formation of soldered joints...

    A. I. Kovtunov, T. V. Semistenova, ... Y. Y. Khokhlov in Steel in Translation

    Article 01 November 2023
    

15. Effect of ultrasonic treatment on interfacial reactions and microstructure of SnCr/CuFeNiCoCr solder joints

    The influences of ultrasonic treatment on interfacial reactions and morphology of SnCr/CuFeNiCoCr solder joints were investigated. The as-reflowed...

    Qing Yang, **aowu Hu in Journal of Materials Science: Materials in Electronics

    Article 15 May 2021
    

16. Influence of phase inhomogeneity on the mechanical behavior of microscale Cu/Sn–58Bi/Cu solder joints

    Electronics are becoming smaller and more versatile, and the size of solder joints has decreased to tens of microns, inducing obvious inhomogeneity...

    Hongbo Qin, Wei Qin, ... Xu Long in Journal of Materials Science: Materials in Electronics

    Article 05 November 2021
    

17. Removal of Oxide Film and Wetting Behavior of Sn9Zn–xSiC Composite Solder on 6061 Aluminum Alloy with Activated Organic Water-Soluble Flux

    Abstract

    The effect of Sn9Zn–xSiC composite solder on the wetting and soldering behavior of 6061 aluminum alloys is investigated using a kind of new...

    Min Ding, Shuyong Li, ... Jian Wang in Metals and Materials International

    Article 28 August 2020
    

18. The effects of the addition of CNT@Ni on the hardness, density, wettability and mechanical properties of Sn-0.7Cu lead-free solder

    Sn-0.7Cu- x CNT@Ni ( x = 0, 0.025, 0.05, 0.075, 0.1 wt.%) nanocomposite solder was prepared by the mechanical alloying method. The effects of CNT@Ni...

    Jun Mao, Wenchao Yang, ... Yongzhong Zhan in Journal of Materials Science: Materials in Electronics

    Article 05 April 2021
    

19. Bond shear strength of Al₂O₃ nanoparticles reinforced 2220-capacitor/SAC305 solder interconnects reflowed on bare and Ni-coated copper substrate

    The influence of Al ₂ O ₃ nanoparticles addition in trace amounts and electroless Ni–P substrate coating on the microstructure development and bond...

    Sanjay Tikale, K. Narayan Prabhu in Journal of Materials Science: Materials in Electronics

    Article 06 January 2021
    

20. Joining of graphite to electrical pure iron using AgCuTi filler alloy and analysis of residual stress within the brazed joint

    In order to solve the heat dissipation of the magnetic coil, the electrical pure iron should be joined to graphite. In this paper, the dissimilar...

    Wen-Wen Li, Bo-Hong Li, ... Ye Liu in Welding in the World

    Article 03 October 2023