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Solid-state diffusion studies of lead-free solders on gold and in polymer films
Lead-free solders are commonly used in microelectronic packages in chip and board level interconnections. They primarily interact with other metals...
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The Effect of Thermal Aging on the Mechanical Properties of Gold-Containing Solder Joints
The reliability of SnPbAg solder joints containing gold (Au) under different aging conditions have been investigated. The solder joints were prepared...
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Introducing solder-based electronics, with solder functioning as resistor, capacitor, and power source
This paper introduces solder-based electronics, wherein solder functions as low-resistance (mΩ) resistor, low-capacitance (pF, permittivity-based)...
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Thermal cycle reliability and creep behavior of nano-IMC mixed solder joints
Herein, the microstructure evolution, crack initiation and propagation, and β-Sn recrystallization behavior of nano-intermetallic compound...
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Interfacial Structure and Mechanical Properties of Lead-Free Bi-Containing Solder/Cu Microelectronic Interconnects
Previous studies have shown that Bi segregation at the Cu 3 Sn/Cu interface in eutectic 42Sn-58Bi/Cu interconnects induces brittle fracture along this...
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Electromigration behavior of Sn–3.0Ag–0.5Cu/Sn–37Pb hybrid solder joints with various mixed percentages for aerospace electronics
The microstructural evolution and failure mode of Sn–3.0Ag–0.5Cu (SAC305)/Sn–37Pb hybrid ball grid array solder joints with various mixed percentages...
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Effects of In addition on the properties of Sn–4Ag–0.5Cu–3Bi–0.05Ni solder
Minor In (0, 0.5, 1, 2 wt%) was doped into the Sn–4Ag–0.5Cu–3Bi–0.05Ni (SACBN) solder to investigate the effects of In on the melting...
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Effect of minor Sb addition on microstructure, interfacial behavior, and mechanical properties of Sn–15Bi solder joints
This paper focuses on the effect of adding minor Sb with different content (1–3 wt.%) into Sn–15Bi solder to improve the microstructure, mechanical...
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Fractography analysis of Sn-58Bi solder joint after addition of cobalt nanoparticles
Miniaturization of electronic devices causes reliability issues in solder joints such as a reduction in mechanical, structural, and electrical...
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Effect of Cu6Sn5 nanoparticles addition on properties of Sn3.0Ag0.5Cu solder joints
The ever-increasing packaging density of electronic products has led to a dramatic reduction in the dimensions of solder joints, which further...
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Characterising Solder Materials from Random Vibration Response of Their Interconnects in BGA Packaging
Solder interconnection in electronic packaging is the weakest link, thus driving the reliability of electronic modules and systems. Improving...
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Influence of Sb on the Performance and Interfacial Behavior of SnBiAg-xSb/Cu Solder Joints
In this work, SnBiAg-xSb solder alloys (where x = 0, 0.5 wt.%, 1.0 wt.%, 1.5 wt.%, 2.0 wt.%, and 2.5 wt.%) were prepared by compression and annealing...
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Enhanced Shear Strength of Sn-Bi/(111)Cu Joints by Refined Distribution of Bi in the Composite Solder
In recent years, Sn-Bi solder has been widely used in the electronic packaging industry due to its low melting point. However, the segregation and...
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Influence of Joint Arrangement on the Fracture Behavior of Lead-Free Solder Joints
The capability to standardize the fracture strength of solder joints is an effective tool to investigate the reliability of electronic devices. To...
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Microstructural evolution of 96.5Sn-3.0Ag-0.5Cu (SAC305) solder joints induced by variation doses of gamma-irradiation
Sn-Ag-Cu-based solder alloys are extensively employed in electronic packaging applications, thus necessitating in-depth reliability studies in...
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Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints
To optimize the mechanical properties of low-Ag lead-free solder, different amount of Bi element was added into the Sn–1.0Ag–0.5Cu (SAC105) to form...
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Study on Microstructure and Joint Strength of Sn-0.7Cu-0.8Zn/Cu Solder Joints by Bi Addition Modification
We have elucidated the roles of Bi addition in the melting characteristics, wettability, microstructure evolution, and mechanical properties of...
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Study of early-stage thermal fatigue behavior of Sn-based Cu-cored BGA solder joints
Conventional solder joints were prone to remelting during multiple reflow packages, causing the chip and substrate to collapse and trigger a short...
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Effect of Trace Boron Nitride Nanoparticles on the Microstructure and Shear Properties of Sn58Bi Solder Joint
In this paper, the influence of 0.01-0.05 wt.% hexagonal boron nitride (BN) nanoparticle do** on the microstructure and shear properties of Sn58Bi...
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Microstructure and mechanical properties of Sn–Bi solder joints reinforced with Zn@Sn core–shell particles
We proposed Zn@Sn particles to improve the mechanical properties of the Sn–58 wt% Bi (Sn58Bi) solder. The effects of 3, 6, and 9 wt% Zn@Sn particles...
