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Microstructure and Shear properties of Sn–xZn Transient Liquid Phase Bonding in 3D-Chip Stacking Packaging
The microstructure and shear property of Cu/Sn– x Zn/Cu ( x = 0, 2, 5, 9, 30, 70 wt.%) composite solder joints fabricated by transient liquid phase...
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Microstructure, electrochemical and mechanical properties of novel Zn–Sn–Cu–Ni high-temperature solder containing a small amount of Al
A novel-type Zn–30Sn–2Cu–0.5Ni–0.2Al multicomponent high-temperature lead-free solder alloy was prepared, and its thermal behavior, electrochemical...
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Flux Modification for Wettability and Reliability Improvement in Solder Joints
Flux is essential in the soldering process. Regardless of the solder materials, soldering process types, and classifications, fluxes are essential...
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Influence of porous Cu interlayer on the intermetallic compound layer and shear strength of MWCNT-reinforced SAC 305 composite solder joints
In this study, the synergetic effect of multi-walled carbon nanotubes (MWCNTs) and porous Cu interlayer (PCI) on the intermetallic compound (IMC)...
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Influences of silicon carbide nanowires’ addition on IMC growth behavior of pure Sn solder during solid–liquid diffusion
In this paper, various mass fractions (0, 0.2, 0.4, 0.6, 0.8, 1.0 wt%) of silicon carbide nanowires (SiC NWs) were incorporated into pure Sn solder...
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Wettability and Rheological Behavior of Low Ag Lead-Free SAC/Graphene and Cobalt-Graphene Nanocomposite Solder Paste
The impacts of dopant nanoparticles, graphene nanosheets (GNSs) and cobalt decorated-graphene nanosheets (CoGNSs), were studied in relation to the...
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Manufacturing and characterization of Sn–Cu/SiO2np lead-free nanocomposite solder by accumulative roll bonding (ARB) process
In this study, lead-free Sn-0.7 wt% Cu and Sn-0.7 wt% Cu/1 wt% SiO 2np nanocomposite solders were manufactured using vacuum melting and accumulative...
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Microstructural, thermal and mechanical properties of Co added Sn–0.7Cu lead-free solder alloy
This study investigated the effects of cobalt microalloying addition on the microstructural features, thermal characteristics and mechanical behavior...
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Effects of GNSs addition on the electromigration of Sn58Bi and Cu-core Sn58Bi joint
Graphene nanosheets (GNSs) modified Sn58Bi and Cu-core Sn58Bi solder joints were manufactured in this work. The evolution of microstructure and...
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Effect of addition of Al and Cu on the properties of Sn–20Bi solder alloy
This study investigates the effect of the composite addition of Al and Cu on the microstructure, physical properties, wettability, and corrosion...
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Effect of Al2O3 Nanoparticle Addition on the Microstructure, Mechanical, Thermal, and Electrical Properties of Melt-Spun SAC355 Lead-Free Solder for Electronic Packaging
This study aims to investigate the impact of low-cost, highly hardened, and thermally stable Al 2 O 3 nanoparticles (NPs) on the physical properties of...
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Surface Modifications on Ceramic Reinforcement for Tin-Based Composite Solders
This chapter aimed to provide a general overview of several surface modifications’ techniques of ceramic reinforcements on the properties of...
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Development of Sn-1.0Ag-0.7Cu composite solder with improved resistivity and strength–ductility synergy through additions of Ni, Te and MWCNT
Multi-walled carbon nanotubes (MWCNTs) reinforced Sn-1.0Ag-0.7Cu (SAC107) composite solders have fabricated by mechanical mixing method. The effects...
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Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0Ag–0.5Cu solder using 1608 chip capacitor/ENIG joints
High entropy alloy (HEA) receives noticeable attention in the electronic industry, and one of the best ways to incorporate HEA with the existing...
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Robust effects of In, Fe, and Co additions on microstructures, thermal, and mechanical properties of hypoeutectic Sn–Zn-based lead-free solder alloy
This study examines the influence of separate and dual minor alloying additions of indium (In) and ferrous/cobalt (Fe/Co) on the microstructure,...
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Effect of trace Ge on interfacial reaction and shear strength of Sn-0.7Cu solder joints during isothermal aging and thermal cycling
To improve the interfacial and mechanical properties of Sn-0.7Cu solder, we tried to add minor Ge into it and investigated the interfacial behavior...
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Effects of Near-amorphous multiphase intermetallic compound particles on the microstructure and mechanical properties of SnBi solders
In this study, near-amorphous multiphase intermetallic compound (IMC) particles were prepared with mass percentages of 0, 0.25, 0.5, and 1% to form...
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RETRACTED ARTICLE: Effect of grain size on the interface structure and shear behavior of lead-free solder joints
This paper investigates the effect of grain size on the evolution and shear behavior of lead-free solder joints. The grain size of the solder is...
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Optimization of Dwell and Ramp Times for SAC305 Solder Thermal Cycling Fatigue Life for Testing and Real-Life Applications
This paper presents solder joint thermal cycling fatigue life analysis and optimization study using finite element analysis (FEA) and design of...
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Research on Microstructure and Shear Behavior of Au/Sn-Ag-Cu/Cu Lead-free Solder Joints at Different Soldering Temperatures
In the actual production process, soldering is a key step in the flip-chip packaging process. The reliability of the interconnection interface of...
