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A microstructural study of mechanical alloying of Fe and Sn powders
Elemental Fe and Sn powders in the ratio of 1:2 were ball-milled for various times at room temperature, and phase transformations in the powders were...
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Glass-forming ability of the Ni-B-Sn system
The glass-forming ability (GFA) of the Ni-B-Sn ternary system has been analysed. The addition of small quantities of tin increases the GFA with...
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The effect of plastic deformation at near room temperature on the solid state reactions between Ni and Sn
Solid state reactions between Ni and Sn at two compositions, Ni 75 Sn 25 and Ni 60 Sn 40 , have been induced by means of near room temperature cold rolling...
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Wettability and Adhesion of Metallic Liquids on Ceramics in Non-Reactive and Reactive Systems
In spite of the difference in nature of cohesive bonds in metals and ceramics, the interfacial bond between liquid metal and iono-covalent oxide is...
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Glass-forming ability of the Ni-B-Sn system
The glass-forming ability (GFA) of the Ni-B-Sn ternary system has been analysed. The addition of small quantities of tin increases the GFA with...
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Rate of dissolution of solid nickel in liquid tin under static conditions
The dissolution kinetics of solid nickel in liquid tin have been investigated under static conditions. The cylindrical nickel specimens were immersed...
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A Study of Intermetallic Compound Development in Nickel-Tin Interfacial Zones
Interdiffusion and intermetallic formation in Ni-Sn interfacial zones are examined by X-ray diffraction in samples prepared by electroplating of Sn...
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The Reaction Kinetics of Liquid 60/40 Sn/Pb Solder with Copper and Nickel: A High Temperature X-Ray Diffraction Study
With proper sample preparation, high temperature x-ray diffraction can be used to study in-situ the reactions occurring at a solder/metal interface....
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Association Model for Liquid Alloys
The concentration and the temperature dependence of thermodynamic mixing functions of liquid alloys with compound formation tendency, which often...
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Erosion behavior and structure of silver-intermetallic compound electrical contact materials
The action of an arc discharge on a contact made of a silver-intermetallic compound composite material is accompanied by selective erosion in the...
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Observations on interdiffusion in planar copper/tin-nickel/gold tricouples
Many of the basic properties of the electrodeposited tin-nickel (Sn-Ni) alloy have been investigated, but two previously unreported aspects are...
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Intermetallic compounds: Their past and promise
This review serves to call attention to intermetallic compounds as a class of materials of great practical importance in both ancient and modern...
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A systematic investigation of the Mössbauer parameters of some intermetallic compounds and electroplated alloys of tin
The Mössbauer parameters of specific intermetallic binary compounds of tin are reported, together with those of electroplated tin-nickel, tin-copper...
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The solubility and solution behavior of antimony and tin in α-lron and the effects of nickel and chromium additions
The solid solubilities of Sn and Sb in α-Fe have been determined by means of lattice parameter measurements. The Sb solubility ranges from a maximum...
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The transformation on annealing of the metastable electrodeposit, NiSnx, to its equilibrium phases
Under slow heating conditions hot-stage transmission electron microscopy has shown that the metastable single-phase intermetallic alloy...