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Showing 1-20 of 497 results
  1. Wafer-level vapor cells filled with laser-actuated hermetic seals for integrated atomic devices

    Atomic devices such as atomic clocks and optically-pumped magnetometers rely on the interrogation of atoms contained in a cell whose inner content...

    Vincent Maurice, Clément Carlé, ... Nicolas Passilly in Microsystems & Nanoengineering
    Article Open access 14 December 2022
  2. Grain Hermetic Storage and Post-Harvest Loss Reduction in Sub-Saharan Africa: Effects on Grain Damage, Weight Loss, Germination, Insect Infestation, and Mold and Mycotoxin Contamination

    Purpose

    The purpose of this study was to review the different hermetic storage (HS) systems used in Sub-Saharan Africa (SSA) and their effectiveness...

    Francis Okori, Sam Cherotich, ... Noble Banadda in Journal of Biosystems Engineering
    Article 11 February 2022
  3. Numerical Investigation of the Effect of Cylinder Head Torque on Gas Leakage in Hermetic Compressors

    Today, while creating compressor designs, energy efficiency and every detail related to it are given importance. In this sense, it’s critical to...
    Conference paper 2024
  4. Optimization of Design Parameters Affecting the Performance of a Magnetic Fluid Rotary Seal

    Three different design parameters of magnetic fluid seal are optimized for the maximum pressure differential capacity of the seal. The program finite...

    Saurabh Parmar, R. V. Upadhyay, Kinnari Parekh in Arabian Journal for Science and Engineering
    Article 16 November 2020
  5. Recent Progress in High-Efficiency Transparent Vacuum Insulation Technologies for Carbon Neutrality

    Enhancing energy efficiency in buildings is a pivotal strategy for reducing energy consumption and mitigating greenhouse gas emissions. As part of...

    Article Open access 20 April 2024
  6. Characterization of a bonding method for titanium-glass sealing

    Applications for smart medical implants require hermetic and mechanically strong seals between functional and biocompatible materials. Hermetic seals...

    Sebastian Winkler, Jan Edelmann, Andreas Schubert in SN Applied Sciences
    Article Open access 20 November 2020
  7. Integrated Circuit Package Types

    This chapter describes the main types of packages and the evolution of package technologies of integrated circuits. Firstly, the definition and...
    Guoliang Yu, Haizhong Shi, Honghui Wang in Handbook of Integrated Circuit Industry
    Reference work entry 2024
  8. Integrated Circuits Packaging Reliability

    Package reliability is a very important aspect for IC products and is studied for the improvement and optimization of package design, processes, and...
    Anjun Huang, Rongzheng Ding, ... Hongwei Luo in Handbook of Integrated Circuit Industry
    Reference work entry 2024
  9. Experimental Studies of the Float-Discrete Method for Measuring the Level of a Heavy Liquid-Metallic Coolant

    Abstract

    The results of experimental studies of the applicability of the float-discrete method for measuring the level of a heavy liquid-metal coolant...

    T. A. Bokova, A. G. Meluzov, ... M. D. Pogorelov in Thermal Engineering
    Article 18 December 2023
  10. Implantable Device Fabrication and Packaging

    Neural implants are developed with regard to the general aspects of active implant design, packaging philosophies, and decisions on manufacturing...
    Thomas Stieglitz in Handbook of Neuroengineering
    Reference work entry 2023
  11. Development of Methods for Optimization and Machine Design of the Connecting Unit of Oil-Field Equipment

    Abstract

    It was determined experimentally that to provide complete sealing, the value of the contact pressure on the sealing surface must be three...

    Article 18 August 2023
  12. Experimental Verification of the Evaporation Model Adequacy

    Abstract

    The article considers the adequacy of the model, which takes into account the dynamics of phase interaction over time, thereby allowing you...

    A. V. Makhan’ko, A. A. Makhan’ko, ... A. E. Blagov in Journal of Machinery Manufacture and Reliability
    Article 01 December 2023
  13. Modeling of Heat Transfer for a Three-Dimensional Microelectromechanical Mirror Element with Consideration of Its Packaging Features

    Abstract

    In a previous study, the authors demonstrated the steps necessary to determine the performance characteristics of a micromechanical mirror...

    S. S. Evstafyev, V. K. Samoylikov, D. V. Vertyanov in Russian Microelectronics
    Article 01 December 2023
  14. Performance Evaluation of PVC-Free Metal Caps from the Point of View of Suitability for Food Contact and Tightness of the Packaging

    In recent years, caps with PVC-free gasket have been developed and produced in the preserved food sector and they have been gradually replacing...

    S. Gelati, A. Sannino, ... C. Zurlini in Journal of Packaging Technology and Research
    Article 09 July 2021
  15. Package Modeling and Characterization of C-Band 10-Watt High-Power Amplifier Monolithic Microwave Integrated Circuit used in High-Reliability Applications

    This paper presents the development of a die-size high-power amplifier (0.25 µm power pHEMT) package model based on open-circuited package...

    Ravi Gugulothu, Sangam Bhalke, ... Ramakrishna Dasari in Journal of The Institution of Engineers (India): Series B
    Article 25 July 2022
  16. On Architectural, Planning and Constructive Solutions of Ethnographic Parks

    The experience of creating ethnographic museum-parks in different countries from the creation of the first ethnographic park “Skansen” to the present...
    Conference paper 2024
  17. Measured Reed Valve Dynamics of Diaphragm Pumps with Laser Doppler Vibrometer

    Pressure controlled reed valves are widely used in compressor technology to control the in- and outflow of the compression chamber. The valves...
    Conference paper 2024
  18. Experimental and numerical investigation on laser transmission welding of stainless steel 304 L and borosilicate glass

    An experimental and numerical study on laser transmission welding (LTW) of borosilicate glass and stainless steel 304 L by a continuous wave fiber...

    Vaidyanath Harinarayana, Yung C. Shin in The International Journal of Advanced Manufacturing Technology
    Article 03 April 2024
  19. Challenges for Large-Scale Brain-Machine Interfaces

    The execution of complex, naturalistic neural tasks relies on the coordinated operation of cortical microcircuits across multiple related functional...
    Farah Laiwalla, Vincent Leung, ... Arto Nurmikko in Handbook of Neuroengineering
    Reference work entry 2023
  20. Biotechnology

    Even today, for most biotechnological processes only a few process data are recorded during fermentation. Instead, samples are taken at intervals and...
    Chapter 2023
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