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Microslip and energy dissipation behaviors of bonding interface considering rough morphology
Lead bonding is a crucial interconnect technology in the fabrication of semiconductor-critical devices. This study presents a mathematical model to...
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Cu-Cu Hybrid Bonding
The brief fundamentals and recent advances and trends of Cu-Cu bumpless hybrid bonding from the IEEE/ECTC 2022 have been reported in [1]. The...
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Laser-Based Glass Frit Bonding
Laser-based low temperature glass frit bonding is used as a long-term encapsulation method for a wide range of products in consumer market and...
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Principles of Superplastic Forming/Diffusion Bonding
Superplastic forming (SPF) is a branch of thermoforming technology. From the perspective of materials science, it belongs to the creep deformation...
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Cu-Cu Hybrid Bonding
Cu-Cu hybrid bondingCu-Cu hybrid bonding is one of the flip chip assembly technologies.
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Reinforcement Bonding of MKG Concrete
In this chapter, the bond behavior between MKG concrete and steel reinforcements is studied by pull-out experiments. The effects of bond size (bond...
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Adhesive Bonding Operations for Aeronautical Materials
This chapter provides an overview of adhesive bonding operations for aeronautical materials, which play a crucial role in joining aircraft...
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Coatability and Bonding Characteristics of Asphalt Binders Modified with Alkylamines-Based and Polyalkylene Glycol-Based Bonding Promoters
Conventional asphalt binder is widely used to produce asphaltic concrete mixtures. The rheological weakness of conventional asphalt binder has...
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Microstructure and Properties of Superplastic Forming/Diffusion Bonding Process
During superplastic forming, the microstructure of the material undergoes changes such as alternations in grain shape and size, grain sliding and...
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Laser Transmission Bonding
The miniaturization in semiconductor industry shows that the temperature stress during packaging of front-end processed wafers with sensitive...
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Investigation of interlayer bonding during pneumatic extruding direct writing deposition
At present, it is recognized that interlayer bonding plays a key role in the overall quality of additive manufacturing (AM)–fabricated parts. The...
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Optimisation of Fe-Al Diffusion Bonding in Air
Joining of dissimilar metal is challenging due to formation of oxide layer on the intermetallic compound at the joining area. Aluminium and steel...
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Test Method of Superplastic Forming/Diffusion Bonding Structure
The single-layer plate structure and two-layer plate structure manufactured by the superplastic forming/diffusion bonding (SPF/DB) process are...
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Study on Ultrasonic Testing of Interface Bonding State of Aluminum Matrix Composites
The ultrasonic reflection characteristics of various interface bonding states of aluminum matrix bonding composites bonded with epoxy resin adhesive...
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Joining of Dissimilar Metals by Diffusion Bonding
This chapter presents the fundamentals of diffusion bonding including mechanism and process parameters like bonding temperature, pressure, time and...
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Can a bulky glycocalyx promote catch bonding in early integrin adhesion? Perhaps a bit
AbstractMany types of cancer cells overexpress bulky glycoproteins to form a thick glycocalyx layer. The glycocalyx physically separates the cell...
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Bonding performance of nano boron nitride filled epoxy adhesive
The objective of this study was to investigate the influence of nano boron nitride (n-BN) particles on the bonding performance of Araldite 2014–2...
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Wafer-to-Wafer Bonding
Wafer-to-wafer bonding techniques are widely used in the semiconductor industry to create a range of complex devices which are now used in many...
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Design Freedoms of Lattice Structures for Interlock Bonding
Additive manufacturing (AM) enables new design freedoms that are often not fully utilized for complexity and price reasons. Lattice structures are...
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Reversible bonding of thermoplastic-based microfluidics with freeze-release adhesive
Bonding is the critical step in the fabrication of thermoplastic-based microfluidic devices to enclose the microchannel. Conventional bonding method...
