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Cu-Cu Hybrid Bonding

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Chiplet Design and Heterogeneous Integration Packaging

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Abstract

Cu-Cu hybrid bonding is one of the flip chip assembly technologies.

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Lau, J.H. (2023). Cu-Cu Hybrid Bonding. In: Chiplet Design and Heterogeneous Integration Packaging. Springer, Singapore. https://doi.org/10.1007/978-981-19-9917-8_6

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