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  1. No Access

    Article

    Dissolution Behavior of Cu-2.0 wt.% Be (Alloy 25) and Cu-0.1 wt.% Fe (C19210) Substrates in Molten Sn-9 wt.%Zn Solder

    This study investigates the dissolution behavior of the Cu-2.0 wt.% Be (Alloy 25) and Cu-0.1 wt.% Fe C19210 substrates in Sn-9 wt.%Zn solder (SZ) at temperatures of 240°C, 270°C, and 300°C for 5–100 min. The c...

    Andromeda Dwi Laksono, Yu-An Shen, Ting Chen, Yee-Wen Yen in JOM (2024)

  2. No Access

    Article

    Bi Dispersion Hardening in Sn-Bi Alloys by Solid-State Aging

    In this study, Bi was added to pure Sn to improve its strength and thermal properties. The presence of 2.5 and 5 wt.% Bi in the Sn matrix lowered the melting point of Sn from 232°C to 229°C and 225°C, respecti...

    Yu-An Shen in JOM (2023)