-
Article
Effect of soybean oil as a carbon source on the electrochemical property of LiNi1/3Co1/3Mn1/3O2 cathode material for lithium ion battery
In this study, soybean oil, which is used in a large variety of processed foods, is used as a carbon source. Soybean oil is successfully coated onto the surface of LiNi1/3Co1/3Mn1/3O2 (NCM) by a simple method. Th...
-
Article
Synthesis of dual nanoparticles embedded in polyimide and their optical properties
We investigated the formation of Cu or ZnO nanoparticles and mixture of Cu and ZnO nanoparticles dispersed in polyimide (PI) films using Cu(NO3)2 and Zn(NO3)2 salts. Each metal salt or the mixture of Cu(NO3)2 and...
-
Article
Effect of permanganate treatment on through mold vias for an embedded wafer level package
In this study, a through mold via (TMV) interconnect was developed for an embedded wafer level package (EMWLP) to enable 3D packing applications. The effects of the shape and surface roughness of the epoxy mol...
-
Article
Facile synthesis of porous-carbon/LiFePO4 nanocomposites
Porous-carbon/LiFePO4 nanocomposites were synthesized by a simple one-step sol–gel process without a pore-forming agent or ball-milling processes. These nanocomposites retained a specific capacity of 96 mAh g−1 e...
-
Article
Mechanism of the Delayed Growth of Intermetallic Compound at the Interface between Sn−4.0Ag−0.5Cu and Cu−Zn Substrate
A Cu−Zn wetting layer was very effective to depress the excessive growth of intermetallic compound (IMC). The effect of Zn addition to the Cu layer on the IMC growth and microvoid formation in the solder inter...
-
Article
A new solder wetting layer for Pb-free solders
We developed a new Cu–Zn wetting layer for Pb-free solders. By adding Zn to the Cu wetting layer, intermetallic growth in the Sn–Ag–Cu (SAC) solder interfaces was delayed. Cu3Sn intermetallic compounds and microv...
-
Article
Improvement of LDI BUMP Strip** Process by Development of Room Temperature PR Stripper
Bump process using gold bump led to many cleaning problems like polymer residues, metal and polyimide consumption after strip** process. First of all, strip** process of bump photoresist is one of the diff...
-
Article
Influence of Cu Deposition Conditions on the Microstructure and Adhesion of Cu/Cr Thin Film to Polyimide Film
The microstructure of Cu thin films in various deposition conditions and the influence of their microstructure on the adhesion strength between Cu/Cr films and polyimides were studied. Cr films (50 nm thick) a...