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  1. No Access

    Article

    A new solder wetting layer for Pb-free solders

    We developed a new Cu–Zn wetting layer for Pb-free solders. By adding Zn to the Cu wetting layer, intermetallic growth in the Sn–Ag–Cu (SAC) solder interfaces was delayed. Cu3Sn intermetallic compounds and microv...

    Chang Yul Oh, Hee-Ra Roh, Young Min Kim, ** Soo Lee… in Journal of Materials Research (2009)

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    Article

    Improvement of LDI BUMP Strip** Process by Development of Room Temperature PR Stripper

    Bump process using gold bump led to many cleaning problems like polymer residues, metal and polyimide consumption after strip** process. First of all, strip** process of bump photoresist is one of the diff...

    Young- Sam Lim, Dong Chan Bae, Hyun-Joon Kim… in MRS Online Proceedings Library (2007)

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    Article

    Influence of Cu Deposition Conditions on the Microstructure and Adhesion of Cu/Cr Thin Film to Polyimide Film

    The microstructure of Cu thin films in various deposition conditions and the influence of their microstructure on the adhesion strength between Cu/Cr films and polyimides were studied. Cr films (50 nm thick) a...

    Cheol-Ho Joh, Young-Ho Kim in MRS Online Proceedings Library (1996)