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  1. No Access

    Article

    Effect of soybean oil as a carbon source on the electrochemical property of LiNi1/3Co1/3Mn1/3O2 cathode material for lithium ion battery

    In this study, soybean oil, which is used in a large variety of processed foods, is used as a carbon source. Soybean oil is successfully coated onto the surface of LiNi1/3Co1/3Mn1/3O2 (NCM) by a simple method. Th...

    Van Hiep Nguyen, Minh Duc Ngo, Young Ho Kim in Carbon Letters (2020)

  2. No Access

    Article

    Synthesis of dual nanoparticles embedded in polyimide and their optical properties

    We investigated the formation of Cu or ZnO nanoparticles and mixture of Cu and ZnO nanoparticles dispersed in polyimide (PI) films using Cu(NO3)2 and Zn(NO3)2 salts. Each metal salt or the mixture of Cu(NO3)2 and...

    Ju Sung Maeng, Dong Joo Choi, Key-one Ahn, Young-Ho Kim in Electronic Materials Letters (2014)

  3. No Access

    Article

    Effect of permanganate treatment on through mold vias for an embedded wafer level package

    In this study, a through mold via (TMV) interconnect was developed for an embedded wafer level package (EMWLP) to enable 3D packing applications. The effects of the shape and surface roughness of the epoxy mol...

    Se-Hoon Park, Ji-Yeon Park, Young-Ho Kim in Electronic Materials Letters (2013)

  4. No Access

    Article

    Facile synthesis of porous-carbon/LiFePO4 nanocomposites

    Porous-carbon/LiFePO4 nanocomposites were synthesized by a simple one-step sol–gel process without a pore-forming agent or ball-milling processes. These nanocomposites retained a specific capacity of 96 mAh g−1 e...

    Sungun Wi, Seunghoon Nam, Yuhong Oh, Jongmin Kim… in Journal of Nanoparticle Research (2012)

  5. No Access

    Article

    Mechanism of the Delayed Growth of Intermetallic Compound at the Interface between Sn−4.0Ag−0.5Cu and Cu−Zn Substrate

    A Cu−Zn wetting layer was very effective to depress the excessive growth of intermetallic compound (IMC). The effect of Zn addition to the Cu layer on the IMC growth and microvoid formation in the solder inter...

    Young Min Kim, Kyoung-Moo Harr, Young-Ho Kim in Electronic Materials Letters (2010)

  6. No Access

    Article

    Improvement of LDI BUMP Strip** Process by Development of Room Temperature PR Stripper

    Bump process using gold bump led to many cleaning problems like polymer residues, metal and polyimide consumption after strip** process. First of all, strip** process of bump photoresist is one of the diff...

    Young- Sam Lim, Dong Chan Bae, Hyun-Joon Kim… in MRS Online Proceedings Library (2007)

  7. No Access

    Article

    Influence of Cu Deposition Conditions on the Microstructure and Adhesion of Cu/Cr Thin Film to Polyimide Film

    The microstructure of Cu thin films in various deposition conditions and the influence of their microstructure on the adhesion strength between Cu/Cr films and polyimides were studied. Cr films (50 nm thick) a...

    Cheol-Ho Joh, Young-Ho Kim in MRS Online Proceedings Library (1996)