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    Morphologies and evolution of intermetallic compounds formed between Sn1.0Ag0.7Cu composite solder and Cu substrate

    This study investigated the morphologies of the intermetallic compounds (IMC) formed during soldering reaction between Sn1.0Ag0.7Cu–1.0SnO2 composite solder and Cu substrate at various temperatures. The prism-typ...

    Yan-Wei Sui, Ren Sun, Ji-Qiu Qi, Ye-Zeng He, Fu-**ang Wei, Qing-Kun Meng… in Rare Metals (2023)