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  1. No Access

    Article

    Morphologies and evolution of intermetallic compounds formed between Sn1.0Ag0.7Cu composite solder and Cu substrate

    This study investigated the morphologies of the intermetallic compounds (IMC) formed during soldering reaction between Sn1.0Ag0.7Cu–1.0SnO2 composite solder and Cu substrate at various temperatures. The prism-typ...

    Yan-Wei Sui, Ren Sun, Ji-Qiu Qi, Ye-Zeng He, Fu-**ang Wei, Qing-Kun Meng… in Rare Metals (2023)

  2. No Access

    Article

    Effects of titanium addition on microstructure and mechanical properties of CrFeNiTix (x = 0.2–0.6) compositionally complex alloys

    CrFeNiTix (x = 0.2, 0.3, 0.4, 0.5, and 0.6 molar ratio) compositionally complex alloys were fabricated by vacuum arc melting to investigate the microstructure, hardness, and compressive properties. The results re...

    Shuo Gao, Teng Kong, Man Zhang, **ao Chen, Yan Wei Sui… in Journal of Materials Research (2019)

  3. Article

    Molecular simulation of interfacial reaction between TiAl alloy melts and different coatings

    The effect of coatings (Y2O3, ZrO2 and Al2O3) on the interfacial reaction of TiAl alloys was studied with molecular dynamics. The binding energy of coatings and the diffusion process of oxygen in the melt were si...

    Yan-wei Sui, Cheng Cheng, Kun Feng, Ji-qiu Qi, Ye-zeng He, Fu-xiang Wei… in China Foundry (2017)

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