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    Article

    Morphologies and evolution of intermetallic compounds formed between Sn1.0Ag0.7Cu composite solder and Cu substrate

    This study investigated the morphologies of the intermetallic compounds (IMC) formed during soldering reaction between Sn1.0Ag0.7Cu–1.0SnO2 composite solder and Cu substrate at various temperatures. The prism-typ...

    Yan-Wei Sui, Ren Sun, Ji-Qiu Qi, Ye-Zeng He, Fu-**ang Wei, Qing-Kun Meng… in Rare Metals (2023)

  2. Article

    Molecular simulation of interfacial reaction between TiAl alloy melts and different coatings

    The effect of coatings (Y2O3, ZrO2 and Al2O3) on the interfacial reaction of TiAl alloys was studied with molecular dynamics. The binding energy of coatings and the diffusion process of oxygen in the melt were si...

    Yan-wei Sui, Cheng Cheng, Kun Feng, Ji-qiu Qi, Ye-zeng He, Fu-xiang Wei… in China Foundry (2017)

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