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  1. No Access

    Article

    A Detailed Study of Void Motion in Passivated Aluminum Interconnects

    Void motion can be an important part of electromigration failure in interconnects. Investigating this process is difficult due to the large variation in behavior in identical samples tested under identical con...

    Jonathan C. Doan, John C. Bravman, Paul A. Flinn… in MRS Online Proceedings Library (1999)

  2. No Access

    Article

    A Quantitative Study of Void Nucleation Times in Passivated Aluminum Interconnects

    Accelerated electromigration tests were performed in a High Voltage SEM (HVSEM). These experiments were conducted on 10 identical, passivated Al interconnect test structures at a temperature of 237°C and a cur...

    Jonathan C. Doan, John C. Bravman, Paul A. Flinn… in MRS Online Proceedings Library (1998)

  3. No Access

    Article

    Measurement and interpretation of strain relaxation in passivated Al–0.5% Cu lines

    X-ray diffraction has been used to measure the strain relaxation in passivated Al–0.5% Cu lines at 200 °C after cooling directly from an anneal at the passivation deposition temperature of 380 °C. Fits to the ...

    Paul R. Besser, Thomas N. Marieb, ** Lee, Paul A. Flinn… in Journal of Materials Research (1996)

  4. No Access

    Article

    Measurement and Interpretation of Strain Relaxation in Passivated Al-0.5%Cu Lines

    X-ray diffraction was used to measure the strain relaxation in passivated Al-0.5%Cu lines at 200°C after cooling directly from an anneal at the passivation deposition temperature. The strain decay is fit with ...

    Paul R. Besser, Thomas N. Marieb, John C. Bravman… in MRS Online Proceedings Library (1994)

  5. No Access

    Article

    In Situ SEM Observations of Electromigration Voids in Al Lines under Passivation

    Paul A. Flinn, Michael C. Madden, Thomas N. Marieb in MRS Bulletin (1994)

  6. No Access

    Article

    Strain relaxation and in-situ observation of voiding in passivated Aluminum alloy lines.

    Strain relaxation in passivated Al-0.5% Cu lines was measured using X-ray diffraction coupled with in-situ observation of the formation and growth of stress induced voids. Samples of 1 µm thick Al-0.5% Cu lines p...

    Paul R. Besser, Thomas N. Marieb, John C. Bravman in MRS Online Proceedings Library (1993)

  7. No Access

    Article

    Strain Relaxation and in-situ Observation of Voiding in Passivated Aluminum Alloy Lines.

    Strain relaxation in passivated Al-0.5% Cu lines was measured using X-ray diffraction coupled with in-situ observation of the formation and growth of stress induced voids. Samples of 1 μm thick Al-0.5% Cu lines p...

    Paul R. Besser, Thomas N. Marieb, John C. Bravman in MRS Online Proceedings Library (1993)

  8. No Access

    Article

    Non-Destructive Evaluation of Strains and Voiding in Passivated Copper Metallizations

    Stress induced voiding in passivated Cu lines was investigated by x–ray strain analysis and in–situ high voltage scanning electron microscope (HVSEM) techniques. Cu lines on a Ta underlayer and Cu lines on an Al ...

    Richard P. Vinci, Thomas N. Marieb, John C. Bravman in MRS Online Proceedings Library (1993)

  9. No Access

    Article

    Non-destructive evaluation of strains and voiding in passivated Copper metallizations

    Stress induced voiding in passivated Cu lines was investigated by x–ray strain analysis and in–situ high voltage scanning electron microscope (HVSEM) techniques. Cu lines on a Ta underlayer and Cu lines on an Al ...

    Richard P. Vinci, Thomas N. Marieb, John C. Bravman in MRS Online Proceedings Library (1993)

  10. No Access

    Article

    Stress-Induced Void Formation in Metal Lines

    Paul A. Flinn, Anne Sauter Mack, Paul R. Besser, Thomas N. Marieb in MRS Bulletin (1993)